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KS524503

Specifications

SKU: 10061168

BUY KS524503 https://www.utsource.net/itm/p/10061168.html

Parameter Symbol Min Typical Max Unit
Supply Voltage Vcc 4.5 - 5.5 V
Output Current Iout - 1.5 3.0 A
Quiescent Current Iq - 10 20 μA
Dropout Voltage Vdo - 200 300 mV
Operating Temperature Topr -40 - 125 °C
Storage Temperature Tstg -65 - 150 °C
Thermal Resistance (θJA) θJA - 50 - °C/W

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (Vcc) is within the range of 4.5V to 5.5V.
    • Use appropriate decoupling capacitors (typically 10μF and 0.1μF) close to the input and output pins to stabilize the power supply.
  2. Output Current:

    • The device can provide a typical output current of 1.5A with a maximum of 3.0A.
    • Ensure that the load does not exceed the maximum output current to avoid damage to the device.
  3. Quiescent Current:

    • The quiescent current (Iq) is typically 10μA and can go up to 20μA.
    • This low quiescent current makes the device suitable for battery-powered applications.
  4. Dropout Voltage:

    • The dropout voltage (Vdo) is typically 200mV and can go up to 300mV.
    • Ensure that the input voltage is at least 200mV to 300mV higher than the output voltage to maintain regulation.
  5. Temperature Considerations:

    • The operating temperature range (Topr) is from -40°C to 125°C.
    • The storage temperature range (Tstg) is from -65°C to 150°C.
    • Avoid exposing the device to temperatures outside these ranges to prevent damage.
  6. Thermal Management:

    • The thermal resistance (θJA) is typically 50°C/W.
    • Use adequate heatsinking if the device will be operating at high output currents or in high ambient temperatures to ensure proper heat dissipation.
  7. PCB Layout:

    • Place the device in a location on the PCB where it can have good airflow.
    • Use wide traces for power and ground connections to minimize resistance and heat generation.
  8. Protection:

    • The device includes built-in protection features such as overcurrent protection and thermal shutdown.
    • However, it is recommended to add external fuses and transient voltage suppressors (TVS) for additional protection in harsh environments.
  9. Handling:

    • Handle the device with care to avoid static discharge.
    • Follow standard ESD (Electrostatic Discharge) precautions when handling and installing the device.
  10. Testing:

    • Before final assembly, test the device under typical operating conditions to ensure it meets the required specifications.
    • Use a multimeter to check for proper voltage levels and current draw.
(For reference only)

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