Instructions:

1. Handling and Storage:

   • Store the module in a dry, cool place to prevent moisture damage.
   • Handle with care to avoid mechanical stress or damage to the terminals.

2. Mounting:

   • Ensure proper heat sinking to maintain the junction temperature within the specified range.
   • Use recommended torque values for mounting screws to avoid over-tightening or under-tightening.

3. Electrical Connections:

   • Apply the correct gate-emitter voltage (±20V) to ensure proper operation.
   • Use short, low-inductance connections for the gate and emitter to minimize switching losses and parasitic effects.

4. Thermal Management:

   • Monitor the junction temperature (Tj) to ensure it does not exceed 150°C.
   • Use thermal paste or thermal interface materials to enhance heat transfer between the module and the heat sink.

5. Testing:

   • Perform initial testing with a low current to verify proper operation before applying full load.
   • Use appropriate test equipment and follow safety guidelines to avoid electrical hazards.

6. Protection:

   • Implement overcurrent protection to prevent damage from excessive currents.
   • Consider using snubber circuits to reduce voltage spikes during switching.

7. Documentation:

   • Refer to the datasheet and application notes for detailed information and specific recommendations.