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SP3243ECA-L/TR

Specifications

SKU: 11190371

BUY SP3243ECA-L/TR https://www.utsource.net/itm/p/11190371.html
IC TRANSCEIVER FULL 3/5 28SSOP
Parameter Description Min Typ Max Unit
Supply Voltage (VCC) Operating supply voltage 4.5 - 5.5 V
Output Current (IOH) Output high-level current - - -0.8 mA
Output Current (IOL) Output low-level current - - 16 mA
Input Voltage (VIH) High-level input voltage 2.0 - 5.5 V
Input Voltage (VIL) Low-level input voltage 0 - 0.8 V
Propagation Delay Time (tPLH) Low to high output propagation delay - 5 - ns
Propagation Delay Time (tPHL) High to low output propagation delay - 5 - ns
Skew (tSKEW) Maximum skew between outputs - - 1 ns
Power Dissipation (PD) Maximum power dissipation - - 715 mW
Operating Temperature (TA) Ambient operating temperature -40 - 85 °C
Storage Temperature (TSTG) Storage temperature range -65 - 150 °C

Instructions for SP3243ECA-L/TR

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the specified range of 4.5V to 5.5V.
    • Connect the ground (GND) pin to a stable reference ground.
  2. Input Signals:

    • Apply input signals (A, B, C, D) with voltages within the valid input voltage ranges:
      • High-level input voltage (VIH): 2.0V to 5.5V
      • Low-level input voltage (VIL): 0V to 0.8V
  3. Output Signals:

    • The device will drive the output signals (Y, Z, W, X) based on the input logic levels.
    • Ensure the output loads do not exceed the maximum output currents:
      • Output high-level current (IOH): -0.8mA
      • Output low-level current (IOL): 16mA
  4. Propagation Delay:

    • The typical propagation delay time (tPLH and tPHL) is 5ns. Ensure that your system timing accounts for this delay.
  5. Skew:

    • The maximum skew between outputs (tSKEW) is 1ns. This should be considered in designs where precise timing is critical.
  6. Thermal Management:

    • The device can dissipate up to 715mW of power. Ensure adequate heat sinking or cooling if operating near the maximum power dissipation.
    • Operate the device within the ambient temperature range of -40°C to 85°C.
  7. Storage:

    • Store the device in a dry environment within the storage temperature range of -65°C to 150°C.
  8. Handling:

    • Handle the device with care to avoid static damage. Use proper ESD protection when handling the component.
  9. Testing:

    • Before integrating the device into a circuit, perform basic functionality tests to ensure it meets the specified parameters.
  10. Documentation:

    • Refer to the datasheet for detailed specifications and application notes.
(For reference only)

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