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S25FL128SAIF00

Specifications

SKU: 11190475

BUY S25FL128SAIF00 https://www.utsource.net/itm/p/11190475.html

Parameter Symbol Min Typical Max Unit Description
Supply Voltage VCC 2.7 3.6 V Operating supply voltage
Standby Current ISB 1.0 2.0 μA Current consumption in standby mode
Active Current IOP 10 30 mA Current consumption during active operation
Programming Current IPGM 1.0 4.0 mA Current required for programming
Erase Time tBERS 3.0 5.0 s Time required for block erase
Page Program Time tPP 0.5 2.0 ms Time required for page program
Read Access Time tR 0.07 0.1 μs Time required to access data from memory
Write Enable Time tWEL 0.0 0.1 μs Time required to enable write operations
Write Disable Time tWDS 0.0 0.1 μs Time required to disable write operations
Data Hold Time tDH 6.0 8.0 ns Time data must be held after clock edge
Data Setup Time tDS 6.0 8.0 ns Time data must be stable before clock edge
Address Setup Time tAS 6.0 8.0 ns Time address must be stable before clock edge
Address Hold Time tAH 6.0 8.0 ns Time address must be held after clock edge
Command Setup Time tCS 6.0 8.0 ns Time command must be stable before clock edge
Command Hold Time tCH 6.0 8.0 ns Time command must be held after clock edge
Chip Enable Setup Time tCES 6.0 8.0 ns Time chip enable must be stable before clock edge
Chip Enable Hold Time tCEH 6.0 8.0 ns Time chip enable must be held after clock edge
Write Protect Setup Time tWPS 6.0 8.0 ns Time write protect must be stable before clock edge
Write Protect Hold Time tWPH 6.0 8.0 ns Time write protect must be held after clock edge
Reset Time tRST 0.0 1.0 μs Time required for reset operation
Power-on Reset Time tPON 0.0 1.0 μs Time required for power-on reset
Temperature Range Toper -40 85 °C Operating temperature range
Storage Temperature Range Tstg -40 125 °C Storage temperature range

Instructions for Using S25FL128SAIF00:

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the specified range of 2.7V to 3.6V.
  2. Initialization:

    • Apply a valid reset sequence by toggling the RESET pin or using the software reset command.
    • Set the chip enable (CE) low to activate the device.
  3. Read Operation:

    • Set CE low.
    • Provide the read command (e.g., 0x03 for standard read).
    • Provide the starting address.
    • Clock in the data at the specified read access time (tR).
  4. Write Operation:

    • Set CE low.
    • Provide the write enable (WREN) command (0x06).
    • Provide the write command (e.g., 0x02 for page program).
    • Provide the starting address.
    • Provide the data to be written.
    • Wait for the write to complete, which can take up to the specified page program time (tPP).
  5. Erase Operation:

    • Set CE low.
    • Provide the write enable (WREN) command (0x06).
    • Provide the block erase command (e.g., 0x52 for 64KB block erase).
    • Provide the starting address of the block to be erased.
    • Wait for the erase to complete, which can take up to the specified block erase time (tBERS).
  6. Status Register Read:

    • Set CE low.
    • Provide the status register read command (0x05).
    • Clock out the status register value to check the busy status (bit 0) and other flags.
  7. Write Protect:

    • Use the write protect (WP) pin to prevent accidental writes or erases.
    • Set WP high to enable write protection.
  8. Power Management:

    • To reduce power consumption, set CE high when the device is not in use.
    • Use the deep power-down mode (DPD) by providing the DPD command (0xB9) to further reduce power consumption.
  9. Temperature Considerations:

    • Ensure the operating temperature is within the specified range of -40°C to 85°C.
    • Store the device within the storage temperature range of -40°C to 125°C.
  10. Handling and Storage:

    • Handle the device with care to avoid electrostatic discharge (ESD) damage.
    • Store the device in a dry, cool environment to prevent moisture damage.
(For reference only)

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