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SN74F32N

Specifications

SKU: 11190723

BUY SN74F32N https://www.utsource.net/itm/p/11190723.html
IC GATE OR 4CH 2-INP 14DIP
Parameter Symbol Min Typ Max Unit Notes
Supply Voltage VCC 4.75 5.0 5.25 V
Input Voltage (High) VIH 2.0 - VCC V
Input Voltage (Low) VIL 0 - 0.8 V
Output Voltage (High) VOH 2.7 - VCC - 0.5 V
Output Voltage (Low) VOL 0 - 0.5 V
Input Current (High) IIH -1 - 20 μA
Input Current (Low) IIL -1 - 1 μA
Output Current (Source) IOH - - 400 μA
Output Current (Sink) IOL - - 16 mA
Propagation Delay Time tpd 15 22 30 ns
Power Dissipation PD - - 500 mW
Operating Temperature TA -55 - 125 °C
Storage Temperature TSTG -65 - 150 °C

Instructions for Use:

  1. Supply Voltage (VCC):

    • Ensure the supply voltage is within the specified range of 4.75V to 5.25V to avoid damage to the device.
  2. Input Voltages:

    • For a high input, the voltage should be between 2.0V and VCC.
    • For a low input, the voltage should be between 0V and 0.8V.
  3. Output Voltages:

    • The output voltage for a high state should be between 2.7V and VCC - 0.5V.
    • The output voltage for a low state should be between 0V and 0.5V.
  4. Current Ratings:

    • The input current for a high state should not exceed 20μA and for a low state should not exceed 1μA.
    • The output can source up to 400μA and sink up to 16mA.
  5. Propagation Delay:

    • The propagation delay time should be considered when designing circuits to ensure timing requirements are met.
  6. Power Dissipation:

    • The maximum power dissipation is 500mW. Ensure proper heat dissipation if operating near this limit.
  7. Temperature Ranges:

    • The operating temperature range is from -55°C to 125°C.
    • The storage temperature range is from -65°C to 150°C.
  8. Handling:

    • Handle the device with care to avoid static damage. Use proper ESD protection measures.
  9. Mounting:

    • Ensure proper soldering and mounting techniques to avoid mechanical stress on the device.
  10. Testing:

    • Perform initial testing at room temperature to verify functionality before deploying in extreme conditions.
(For reference only)

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