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NTR2101PT1G

Specifications

SKU: 11194250

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Parameter Symbol Min Typ Max Unit Notes
Supply Voltage VCC 2.7 - 5.5 V -
Continuous Drain Current ID(cont) - 1.0 - A @ TA = 25°C, VGS = 4.5V
Peak Pulse Current ID(peak) - 1.8 - A @ TC = 25°C, VGS = 4.5V, tP = 1ms, Duty Cycle = 1%
Gate-Source Voltage VGS -20 - 20 V -
Drain-Source Breakdown Voltage VDS(off) - 30 - V @ ID = 1mA, VGS = 0V
Gate Threshold Voltage VGS(th) 1.0 1.5 2.5 V @ ID = 250μA, TA = 25°C
On-State Resistance RDS(on) - 0.5 - Ω @ VGS = 4.5V, ID = 1A, TA = 25°C
Input Capacitance Ciss - 60 - pF @ VDS = 10V, f = 1MHz
Output Capacitance Coss - 20 - pF @ VDS = 10V, f = 1MHz
Reverse Transfer Capacitance Crss - 10 - pF @ VDS = 10V, f = 1MHz
Junction Temperature TJ -55 - 150 °C -
Storage Temperature TSTG -55 - 150 °C -

Instructions for Use:

  1. Supply Voltage (VCC):

    • Ensure the supply voltage is within the range of 2.7V to 5.5V to avoid damage to the device.
  2. Continuous Drain Current (ID(cont)):

    • The maximum continuous drain current is 1.0A at 25°C ambient temperature. Ensure adequate heat dissipation for higher temperatures or currents.
  3. Peak Pulse Current (ID(peak)):

    • The device can handle peak pulse currents up to 1.8A for short durations (1ms, 1% duty cycle). Ensure that the pulse conditions do not exceed these limits.
  4. Gate-Source Voltage (VGS):

    • The gate-source voltage should not exceed ±20V to prevent damage to the gate oxide.
  5. Drain-Source Breakdown Voltage (VDS(off)):

    • The drain-source breakdown voltage is 30V. Do not exceed this voltage when the device is off.
  6. Gate Threshold Voltage (VGS(th)):

    • The gate threshold voltage ranges from 1.0V to 2.5V. Ensure the gate voltage is above this range to fully turn on the device.
  7. On-State Resistance (RDS(on)):

    • The on-state resistance is typically 0.5Ω at 4.5V gate-source voltage and 1A drain current. This value can affect power dissipation and efficiency.
  8. Capacitances (Ciss, Coss, Crss):

    • These capacitances affect the switching speed and performance. Use appropriate gate drive circuits to minimize switching losses.
  9. Temperature Ranges:

    • The junction temperature should not exceed 150°C. The storage temperature range is -55°C to 150°C.
  10. Handling Precautions:

    • Handle the device with care to avoid static damage. Use proper ESD protection measures during handling and assembly.
  11. Mounting:

    • Ensure proper mounting and thermal management to maintain device reliability and performance. Use a heatsink if necessary to dissipate heat effectively.
  12. Testing:

    • Follow the recommended test conditions and procedures to ensure accurate characterization and reliable operation.
(For reference only)

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