Share:


PMEG2010EA

Specifications

SKU: 11196648

BUY PMEG2010EA https://www.utsource.net/itm/p/11196648.html
You deserve it
Parameter Symbol Test Conditions Min Typical Max Unit
Drain-Source Voltage VDS - 200 - V
Gate-Source Voltage VGS - ±20 - V
Continuous Drain Current ID VDS = 25V, TA = 25°C - 10 - A
Pulse Drain Current ID(p) VDS = 25V, TC = 25°C, tp = 10ms, Duty Cycle = 1% - 30 - A
Gate-Source Threshold Voltage VGS(th) ID = 250μA, TA = 25°C 2.0 4.0 6.0 V
On-State Resistance RDS(on) VGS = 10V, ID = 5A, TA = 25°C - 1.2 - Ω
Input Capacitance Ciss VDS = 15V, f = 1MHz - 1100 - pF
Output Capacitance Coss VDS = 15V, f = 1MHz - 330 - pF
Reverse Transfer Capacitance Crss VDS = 15V, VGS = 0V, f = 1MHz - 170 - pF
Total Gate Charge QG VDS = 25V, VGS = 10V, ID = 5A - 40 - nC
Gate-Source Charge QGS VDS = 25V, VGS = 10V, ID = 5A - 10 - nC
Gate-Drain Charge QGD VDS = 25V, VGS = 10V, ID = 5A - 30 - nC
Drain-Source Breakdown Voltage VBDS ID = 250μA, TA = 25°C - 200 - V
Power Dissipation PD TC = 25°C - 125 - W
Junction Temperature TJ - - 150 °C
Storage Temperature Range TSTG -65 - 150 °C

Instructions for Use:

  1. Handling Precautions:

    • The PMEG2010EA is sensitive to electrostatic discharge (ESD). Handle with care and use appropriate ESD protection.
    • Avoid exceeding the maximum ratings specified in the table to prevent damage to the device.
  2. Mounting and Assembly:

    • Ensure proper heat sinking to manage the power dissipation, especially when operating at high currents or in high ambient temperatures.
    • Follow the recommended PCB layout guidelines to minimize parasitic inductances and ensure reliable performance.
  3. Operating Conditions:

    • Operate within the specified temperature range to avoid thermal runaway and ensure long-term reliability.
    • Monitor the junction temperature to ensure it does not exceed the maximum rated value.
  4. Gate Drive:

    • Use a gate drive circuit that can provide sufficient current to charge and discharge the gate capacitance quickly, ensuring fast switching times and minimizing switching losses.
    • Ensure the gate voltage is within the specified range to avoid overdriving the device and causing damage.
  5. Testing:

    • When testing the device, use the test conditions specified in the parameter table to obtain accurate measurements.
    • Use appropriate test equipment and techniques to avoid introducing errors or damaging the device.
  6. Storage:

    • Store the device in a dry, cool environment to prevent moisture absorption and degradation.
    • Keep the device in its original packaging until ready for use to protect against static and physical damage.
(For reference only)

 Inquiry - PMEG2010EA