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SN74LVC1G3157DCKR

Specifications

SKU: 11196809

BUY SN74LVC1G3157DCKR https://www.utsource.net/itm/p/11196809.html
IC SWITCH SPDT SC70-6
Parameter Description Min Typ Max Unit
VCC Supply Voltage 1.65 - 5.5 V
ICC Supply Current (Typical, VOH = 2.0V) - 1 - μA
VIH Input High Voltage 2.0 - 5.5 V
VIL Input Low Voltage 0 - 0.8 V
VOH Output High Voltage (IOL = -4mA) 2.4 - VCC - 0.1 V
VOL Output Low Voltage (IOL = 16mA) 0 - 0.1 V
IOH Output High Current (VOH = 2.4V) - - -4 mA
IOL Output Low Current (VOL = 0.4V) - - 16 mA
tpd Propagation Delay Time (VCC = 3.3V) - 4.9 - ns
tphl High-to-Low Propagation Delay Time (VCC = 3.3V) - 4.9 - ns
tplh Low-to-High Propagation Delay Time (VCC = 3.3V) - 4.9 - ns
tskew Skew (VCC = 3.3V) - 0.5 - ns
tCO Output Change Time (VCC = 3.3V) - 2.5 - ns
tSU Input Setup Time (VCC = 3.3V) - 2.5 - ns
tH Input Hold Time (VCC = 3.3V) - 0.5 - ns

Instructions for Use:

  1. Supply Voltage (VCC):

    • Ensure the supply voltage is within the range of 1.65V to 5.5V.
    • Avoid connecting the supply voltage outside this range to prevent damage to the device.
  2. Input Voltage Levels:

    • Input high (VIH) should be at least 2.0V and can go up to the supply voltage (VCC).
    • Input low (VIL) should be no more than 0.8V.
  3. Output Voltage Levels:

    • Output high (VOH) will be at least 2.4V when the output current (IOH) is -4mA.
    • Output low (VOL) will be no more than 0.1V when the output current (IOL) is 16mA.
  4. Propagation Delay:

    • The typical propagation delay time (tpd) is 4.9ns at VCC = 3.3V.
    • The high-to-low (tphl) and low-to-high (tplh) propagation delays are also 4.9ns under the same conditions.
  5. Skew and Timing:

    • The skew (tskew) is typically 0.5ns.
    • The output change time (tCO) is 2.5ns.
    • The input setup time (tSU) is 2.5ns, and the input hold time (tH) is 0.5ns.
  6. Power Consumption:

    • The typical supply current (ICC) is 1μA when VOH = 2.0V.
  7. Handling:

    • Handle the device with care to avoid static damage.
    • Store the device in a dry environment to prevent moisture damage.
  8. Mounting:

    • Ensure proper soldering techniques are used to avoid thermal stress.
    • Follow the recommended PCB layout guidelines for optimal performance.
  9. Testing:

    • Before integrating the device into a circuit, test it with a simple setup to ensure it functions correctly.
  10. Compliance:

    • Ensure the device complies with all relevant safety and regulatory standards for your application.
(For reference only)

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