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SN74LVC1G11DCKR

Specifications

SKU: 11196818

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Parameter Symbol Min Typical Max Unit Conditions
Supply Voltage VCC 1.65 - 5.5 V
Input Low Voltage VIL 0 0.8 - V VCC = 3.3V
Input High Voltage VIH - 2.0 VCC V VCC = 3.3V
Output Low Voltage VOL 0 0.1 0.4 V IOL = 4 mA, VCC = 3.3V
Output High Voltage VOH 2.4 3.2 VCC - 0.4 V IOH = -4 mA, VCC = 3.3V
Propagation Delay Time tpd - 4.0 9.0 ns VCC = 3.3V, TA = 25°C
Power Dissipation Ptot - - 100 mW Junction Temperature (TJ) = 125°C
Operating Temperature Range TA -40 - 85 °C Commercial Grade
Storage Temperature Range TSTG -65 - 150 °C

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the range of 1.65V to 5.5V.
    • Connect the ground (GND) pin to a stable 0V reference.
  2. Input Signals:

    • Apply input signals (VIL and VIH) that meet the specified voltage levels for logic low and high, respectively.
    • Avoid applying voltages outside the recommended range to prevent damage to the device.
  3. Output Signals:

    • The output signals (VOL and VOH) will be driven to the appropriate levels based on the input state.
    • Ensure the load connected to the output does not exceed the maximum current ratings (IOL and IOH).
  4. Propagation Delay:

    • The propagation delay time (tpd) is the time it takes for the output to respond to a change in the input signal. This value is typically around 4.0 ns at 3.3V and 25°C.
  5. Temperature Considerations:

    • Operate the device within the specified temperature range (TA) to ensure reliable performance.
    • Store the device in a temperature-controlled environment within the storage temperature range (TSTG).
  6. Power Dissipation:

    • Monitor the power dissipation (Ptot) to ensure it does not exceed the maximum rating, especially under high-temperature conditions.
  7. Handling:

    • Handle the device with care to avoid static discharge, which can damage the internal circuits.
    • Follow proper soldering techniques to ensure good electrical connections and to prevent thermal stress.
(For reference only)

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