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IRLML6244TRPBF

Specifications

SKU: 11199686

BUY IRLML6244TRPBF https://www.utsource.net/itm/p/11199686.html

Parameter Symbol Min Typical Max Unit Conditions
Drain-Source Voltage VDS - 30 - V
Gate-Source Voltage VGS -15 0 8 V
Continuous Drain Current ID (DC) - 3.7 - A TC = 25°C
Continuous Drain Current ID (DC) - 2.7 - A TC = 70°C
Pulse Drain Current ID (Pulse) - 9.3 - A TC = 25°C, tP = 10 μs, Duty Cycle = 1%
Power Dissipation Ptot - 1.1 - W TC = 25°C
Junction Temperature TJ - - 150 °C
Storage Temperature TSTG -55 - 150 °C
Thermal Resistance, Junction to Ambient RθJA - 125 - °C/W
Input Capacitance Ciss - 310 - pF VDS = 10 V, f = 1 MHz
Output Capacitance Coss - 110 - pF VDS = 10 V, f = 1 MHz
Reverse Transfer Capacitance Crss - 50 - pF VDS = 10 V, f = 1 MHz
Gate Charge QG - 12 - nC VDS = 10 V, VGS = 10 V, ID = 3.7 A
Threshold Voltage VGS(th) 0.8 1.2 1.6 V ID = 250 μA
On-State Resistance RDS(on) - 0.075 - Ω VGS = 10 V, ID = 3.7 A, TJ = 25°C
On-State Resistance RDS(on) - 0.12 - Ω VGS = 4.5 V, ID = 2.7 A, TJ = 25°C

Instructions for Use:

  1. Operating Conditions:

    • Ensure that the drain-source voltage (VDS) does not exceed 30 V.
    • The gate-source voltage (VGS) should be within -15 V to 8 V.
    • Do not exceed the continuous drain current (ID) limits based on the case temperature (TC).
  2. Thermal Management:

    • Keep the junction temperature (TJ) below 150°C to avoid thermal damage.
    • Use appropriate heat sinks or cooling methods if operating at high power levels.
  3. Capacitance and Gate Charge:

    • Consider the input capacitance (Ciss), output capacitance (Coss), and reverse transfer capacitance (Crss) when designing the gate drive circuit.
    • The gate charge (QG) affects the switching speed; ensure the gate driver can supply sufficient current.
  4. Threshold Voltage and On-State Resistance:

    • The threshold voltage (VGS(th)) determines the minimum gate voltage required to turn the MOSFET on.
    • The on-state resistance (RDS(on)) affects the power dissipation; use the appropriate VGS to minimize it.
  5. Storage and Handling:

    • Store the device in a dry, cool place with temperatures between -55°C and 150°C.
    • Handle the device with care to avoid static discharge, which can damage the sensitive components.
  6. Mounting:

    • Ensure proper mounting to the PCB to maintain good electrical and thermal connections.
    • Follow the recommended soldering profile to avoid damage during assembly.
  7. Testing:

    • Test the device under controlled conditions to verify its performance and ensure it meets the specified parameters.
(For reference only)

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