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MBI6651GSD

Specifications

SKU: 11203451

BUY MBI6651GSD https://www.utsource.net/itm/p/11203451.html

Parameter Symbol Min Typical Max Unit Conditions
Supply Voltage VDD 2.7 - 5.5 V
Output Current per Channel IOUT - 300 - mA Continuous, per channel
Peak Output Current IPEAK - 400 - mA 10% duty cycle, per channel
Operating Temperature TOPR -40 - 85 °C Storage: -55 to 150°C
Quiescent Current IQ - 200 - μA VDD = 5V, no load
Thermal Shutdown TSD - 150 - °C Typical
Under-Voltage Lockout UVLO 2.3 - 2.7 V VDD
Short-Circuit Protection SCP - - - - Automatic recovery
ESD Rating HBM - - 4000 V Human Body Model

Instructions for Using MBI6651GSD

  1. Supply Voltage (VDD):

    • Ensure the supply voltage is within the range of 2.7V to 5.5V.
    • Avoid connecting the supply voltage outside this range to prevent damage to the device.
  2. Output Current (IOUT):

    • The maximum continuous output current per channel is 300mA.
    • For peak currents up to 400mA, ensure the duty cycle does not exceed 10%.
  3. Operating Temperature (TOPR):

    • The operating temperature range is from -40°C to 85°C.
    • Store the device between -55°C and 150°C.
  4. Quiescent Current (IQ):

    • The quiescent current is typically 200μA when VDD is 5V and there is no load.
  5. Thermal Shutdown (TSD):

    • The device will automatically shut down if the temperature exceeds 150°C to prevent damage.
    • Allow the device to cool down before resuming operation.
  6. Under-Voltage Lockout (UVLO):

    • The device will enter a low-power state if the supply voltage drops below 2.3V.
    • Normal operation resumes when the supply voltage rises above 2.7V.
  7. Short-Circuit Protection (SCP):

    • The device has built-in short-circuit protection with automatic recovery.
    • In the event of a short circuit, the device will limit the current and attempt to recover.
  8. ESD Rating (HBM):

    • The device can withstand up to 4000V of electrostatic discharge according to the Human Body Model.
    • Use appropriate ESD protection measures during handling and installation.
  9. General Handling:

    • Handle the device with care to avoid mechanical stress.
    • Follow proper soldering techniques to ensure reliable connections.
  10. Layout Considerations:

    • Use a good ground plane to minimize noise and improve thermal performance.
    • Keep power and ground traces as short as possible to reduce inductance and improve stability.

By following these guidelines, you can ensure optimal performance and reliability of the MBI6651GSD in your application.

(For reference only)

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