Instructions:

1. Mounting:

   • Ensure the device is mounted on a PCB with proper heat dissipation if operating at high current or temperature.
   • Use appropriate soldering techniques to avoid thermal shock.

2. Handling:

   • Handle the device with care to prevent mechanical damage.
   • Follow ESD (Electrostatic Discharge) precautions to avoid damaging the component.

3. Operating Conditions:

   • Do not exceed the maximum clamping voltage (VC) under any conditions.
   • Ensure the peak pulse current (Ipp) does not exceed 4.9A for 8/20μs pulses.
   • The device should operate within the specified temperature range (-55°C to 150°C).

4. Testing:

   • Test the device under controlled conditions to verify its performance.
   • Measure the leakage current (IL) at the specified reverse working voltage (VRWM) to ensure it is within the acceptable range.

5. Storage:

   • Store the device in a dry, cool place to prevent moisture damage.
   • Keep the device away from direct sunlight and sources of heat.