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IRS2106PBF

Specifications

SKU: 11214370

BUY IRS2106PBF https://www.utsource.net/itm/p/11214370.html
IC DRIVER HIGH/LOW SIDE 8-DIP
Parameter Symbol Min Typical Max Unit Description
Supply Voltage Vcc 10 - 20 V Operating supply voltage range
Gate Drive Voltage (High Side) VGH 10 - 20 V High-side gate drive output voltage
Gate Drive Voltage (Low Side) VGL 10 - 20 V Low-side gate drive output voltage
Input High Level Voltage VIH 4.5 - - V Minimum input high level voltage
Input Low Level Voltage VIL - - 0.8 V Maximum input low level voltage
Propagation Delay Time (High to Low) tPHL - 50 100 ns Propagation delay time from input to output (high to low)
Propagation Delay Time (Low to High) tPLH - 50 100 ns Propagation delay time from input to output (low to high)
Dead Time tD 100 - 300 ns Dead time between high-side and low-side outputs
Maximum Operating Junction Temperature TJ(max) - - 150 °C Maximum operating junction temperature
Storage Temperature Range TSTG -55 - 150 °C Storage temperature range
Output Current (Source) IOH - 2.5 4 A Maximum source current per output
Output Current (Sink) IOL - 2.5 4 A Maximum sink current per output

Instructions for Using IRS2106PBF

  1. Power Supply:

    • Ensure the supply voltage (Vcc) is within the range of 10V to 20V.
    • Connect the Vcc pin to a stable power supply.
  2. Input Signals:

    • Apply input signals to the IN pin with a high level voltage (VIH) of at least 4.5V and a low level voltage (VIL) of no more than 0.8V.
    • Ensure the input signals are clean and free from noise to avoid false triggering.
  3. Gate Drive Outputs:

    • The high-side gate drive output (HO) and low-side gate drive output (LO) can provide up to 4A of source or sink current.
    • Connect the HO and LO pins to the gates of the MOSFETs you are driving.
  4. Dead Time:

    • The IRS2106PBF includes a built-in dead time of 100 to 300 nanoseconds to prevent shoot-through current in half-bridge configurations.
    • Adjust the dead time if necessary using external components, but ensure it remains within the specified range.
  5. Thermal Management:

    • Keep the junction temperature (TJ) below 150°C to ensure reliable operation.
    • Use appropriate heat sinks or cooling methods if the device is expected to operate at high temperatures.
  6. Storage and Handling:

    • Store the device in a temperature range of -55°C to 150°C.
    • Handle the device with care to avoid damage from static electricity and physical stress.
  7. Layout Considerations:

    • Keep the PCB traces connecting the gate drive outputs (HO and LO) to the MOSFETs as short as possible to minimize parasitic inductance.
    • Use bypass capacitors close to the Vcc and GND pins to filter out noise and provide stable power.
  8. Testing:

    • Before finalizing the design, test the circuit under various operating conditions to ensure it meets the performance requirements.
    • Verify the correct operation of the high-side and low-side drivers by monitoring the gate drive signals and the output waveforms.

By following these guidelines, you can effectively use the IRS2106PBF in your power electronics applications.

(For reference only)

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