Specifications
SKU: 11218101
Parameter | Symbol | Min | Typ | Max | Unit | Notes |
---|---|---|---|---|---|---|
Input Voltage | VIN | 2.5 | - | 5.5 | V | |
Output Current | IOUT | - | 10 | - | A | Continuous |
Switching Frequency | fSW | - | 300 | - | kHz | Typical |
Efficiency | η | - | 92 | - | % | At nominal conditions |
Quiescent Current | IQ | - | 2.5 | - | mA | Typical |
Shutdown Current | ISD | - | 0.1 | - | μA | Typical |
Thermal Shutdown | TSD | - | 160 | - | °C | Typical |
Operating Temperature | TA | -40 | - | 125 | °C | |
Storage Temperature | TSTG | -55 | - | 150 | °C | |
Junction Temperature | TJ | -40 | - | 150 | °C |
Instructions for Use:
Power Supply Connection:
- Connect the input voltage (VIN) to the power supply within the specified range of 2.5V to 5.5V.
- Ensure that the power supply is stable and free from excessive ripple or noise.
Output Load:
- The device can provide a continuous output current (IOUT) of up to 10A.
- Ensure that the load does not exceed this limit to avoid overheating and potential damage.
Thermal Management:
- The device has a maximum junction temperature (TJ) of 150°C.
- Use appropriate heatsinking or cooling methods to maintain the operating temperature within the specified range (-40°C to 125°C).
Switching Frequency:
- The typical switching frequency (fSW) is 300kHz.
- This frequency is optimized for efficiency and performance, but can be adjusted if necessary.
Efficiency:
- The device operates with a typical efficiency (η) of 92% under nominal conditions.
- Monitor the efficiency to ensure optimal performance and adjust the design if needed.
Quiescent and Shutdown Current:
- The quiescent current (IQ) is typically 2.5mA, and the shutdown current (ISD) is typically 0.1μA.
- These values help in minimizing power consumption during normal and shutdown modes.
Thermal Shutdown:
- The device includes thermal shutdown protection, which activates at approximately 160°C.
- This feature helps prevent damage due to excessive heat.
Storage and Handling:
- Store the device in a dry environment within the storage temperature range (-55°C to 150°C).
- Handle the device with care to avoid mechanical stress or damage.
Soldering and Assembly:
- Follow recommended soldering profiles to ensure reliable connections.
- Avoid excessive heat during soldering to prevent damage to the device.
Testing and Validation:
- Perform thorough testing and validation of the circuit to ensure it meets the required specifications and performance criteria.
- Use appropriate test equipment and procedures to validate the operation of the device.
Inquiry - IRG4RC10KD