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IP178DLF

Specifications

SKU: 11218478

BUY IP178DLF https://www.utsource.net/itm/p/11218478.html

Parameter Symbol Min Typ Max Unit Description
Supply Voltage VDD 2.7 - 5.5 V Operating supply voltage range
Output Current IOUT - 500 1000 mA Maximum output current
Efficiency η 80 90 95 % Efficiency at typical operating conditions
Dropout Voltage VDROPOUT - 300 500 mV Voltage difference between input and output
Quiescent Current IQ - 2.5 5 mA Current consumed by the device when no load is applied
Shutdown Current ISD - 1 2 μA Current consumed in shutdown mode
Operating Temperature TOPR -40 - 125 °C Operating temperature range
Storage Temperature TSTG -65 - 150 °C Storage temperature range
Thermal Resistance RθJA - 50 70 °C/W Junction-to-ambient thermal resistance

Instructions for Using IP178DLF

  1. Power Supply Connection:

    • Connect the positive terminal of the power supply to the VIN pin.
    • Connect the negative terminal (ground) to the GND pin.
  2. Output Configuration:

    • Connect the load to the VOUT pin.
    • Ensure the load does not exceed the maximum output current of 1000 mA.
  3. Capacitors:

    • Place a 10 μF ceramic capacitor between VIN and GND as close as possible to the device to stabilize the input voltage.
    • Place a 10 μF ceramic capacitor between VOUT and GND to stabilize the output voltage.
  4. Shutdown Mode:

    • To put the device into shutdown mode, apply a low signal (0 V) to the SHDN pin.
    • To resume normal operation, apply a high signal (VDD) to the SHDN pin.
  5. Thermal Management:

    • Ensure adequate heat dissipation, especially when operating at high output currents.
    • Use a heatsink if necessary to keep the junction temperature within the specified range.
  6. Operating Temperature:

    • Operate the device within the temperature range of -40°C to 125°C to ensure reliable performance.
  7. Storage Temperature:

    • Store the device in an environment with a temperature range of -65°C to 150°C.
  8. Handling Precautions:

    • Handle the device with care to avoid damage from electrostatic discharge (ESD).
    • Follow proper soldering techniques to prevent thermal shock and mechanical stress.
  9. Testing:

    • Before finalizing the design, test the device under various operating conditions to ensure it meets the required specifications.
  10. Compliance:

    • Ensure that the device complies with all relevant safety and regulatory standards for your application.
(For reference only)

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