Instructions for Use:

1. Handling Precautions:

   • Handle the 2SD965-R with care to avoid mechanical damage.
   • Use appropriate anti-static measures to prevent electrostatic discharge (ESD) damage.

2. Mounting:

   • Ensure proper alignment of the component leads during soldering.
   • Use a heat sink if necessary to manage thermal dissipation, especially for continuous high-power applications.

3. Soldering:

   • Soldering temperature should not exceed 260°C for more than 10 seconds.
   • Allow the component to cool naturally after soldering.

4. Electrical Connections:

   • Connect the collector (C), base (B), and emitter (E) terminals correctly according to your circuit design.
   • Ensure that the maximum ratings are not exceeded under any operating conditions.

5. Thermal Management:

   • Monitor the junction temperature (T_J) to ensure it stays within safe limits.
   • Consider derating the power dissipation at higher ambient temperatures.

6. Storage:

   • Store the 2SD965-R in a dry, cool place away from direct sunlight and corrosive environments.

7. Testing:

   • Before final assembly, test the component using a multimeter or a transistor tester to ensure it meets the specified parameters.

8. Compliance:

   • Ensure that the use of the 2SD965-R complies with all relevant safety and regulatory standards for your application.