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SN74HC245NSR

Specifications

SKU: 11220019

BUY SN74HC245NSR https://www.utsource.net/itm/p/11220019.html

Parameter Symbol Conditions Min Typical Max Unit
Supply Voltage VCC - 2.0 - 6.0 V
Input Voltage (High) VIH - 3.15 - VCC + 0.5 V
Input Voltage (Low) VIL - 0 - 0.85 V
Output Voltage (High) VOH IOL = 0.4 mA VCC - 0.2 - VCC V
Output Voltage (Low) VOL IOL = 8 mA 0 - 0.2 V
Input Leakage Current IIL VIN = 0 to VCC -1 - 1 μA
Output Leakage Current IOL VOUT = 0 to VCC -1 - 1 μA
Propagation Delay Time tpd VCC = 4.5 V, fo = 10 MHz 6 - 14 ns
Power Dissipation PTOT - - - 350 mW
Operating Temperature Range TA - -40 - 85 °C
Storage Temperature Range TSTG - -65 - 150 °C

Instructions for SN74HC245NSR

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the range of 2.0 V to 6.0 V.
    • Connect the ground (GND) pin to the system ground.
  2. Input Signals:

    • The input signals should be within the valid logic levels:
      • High: VIH ≥ 3.15 V (for VCC = 5 V)
      • Low: VIL ≤ 0.85 V (for VCC = 5 V)
    • Avoid applying voltages outside the specified range to prevent damage.
  3. Output Signals:

    • The output signals will be:
      • High: VOH ≥ VCC - 0.2 V
      • Low: VOL ≤ 0.2 V
    • Ensure the load connected to the outputs does not exceed the maximum current ratings.
  4. Direction Control:

    • Use the direction control pins (DIR) to set the direction of data transfer:
      • DIR = 0: Data transfers from A to B
      • DIR = 1: Data transfers from B to A
  5. Enable Control:

    • Use the enable pins (OE) to control the output state:
      • OE = 0: Outputs are active
      • OE = 1: Outputs are high-impedance (tristate)
  6. Propagation Delay:

    • The propagation delay time (tpd) is typically between 6 ns and 14 ns at VCC = 4.5 V and fo = 10 MHz. Ensure your system timing accounts for this delay.
  7. Temperature Considerations:

    • Operate the device within the temperature range of -40°C to 85°C.
    • Store the device in a temperature range of -65°C to 150°C.
  8. Handling:

    • Handle the device with care to avoid electrostatic discharge (ESD) damage.
    • Follow proper ESD precautions when handling and soldering the device.
  9. Mounting:

    • Ensure proper mounting and soldering techniques to avoid mechanical stress on the device.
    • Use appropriate thermal management techniques if operating at high power levels or in high-temperature environments.
  10. Testing:

    • Test the device under the specified conditions to ensure it meets the required performance parameters.
    • Verify the functionality using a known good test setup before integrating into a larger system.
(For reference only)

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