Specifications
SKU: 11221491
Parameter | Description | Min | Typ | Max | Unit |
---|---|---|---|---|---|
VIN | Input Voltage | 4.5 | - | 40 | V |
VOUT | Output Voltage | - | - | 36 | V |
IOUT | Output Current | - | 2.5 | 3.0 | A |
fSW | Switching Frequency | - | 500 | - | kHz |
IQ | Quiescent Current | - | 1.5 | - | mA |
VUVLO | Under-Voltage Lockout Threshold | 4.0 | - | 4.3 | V |
VOVLO | Over-Voltage Lockout Threshold | 42 | - | 44 | V |
Tj | Junction Temperature | -40 | - | 150 | °C |
θJA | Junction-to-Ambient Thermal Resistance | - | 50 | - | °C/W |
Instructions for NCV7708BDWR2G:
Power Supply Connection:
- Connect the input voltage (VIN) to the power supply, ensuring it is within the range of 4.5V to 40V.
- Ensure the output voltage (VOUT) is set appropriately for your application, not exceeding 36V.
Output Current:
- The device can deliver a continuous output current of up to 3.0A. For optimal performance, keep the output current around 2.5A.
Switching Frequency:
- The switching frequency is fixed at 500kHz. This value should be considered when designing the external components such as inductors and capacitors.
Quiescent Current:
- The quiescent current is typically 1.5mA. This is the current drawn by the device when no load is applied.
Under-Voltage Lockout (UVLO):
- The device will shut down if the input voltage drops below 4.0V and will restart when the voltage rises above 4.3V.
Over-Voltage Lockout (OVLO):
- The device will shut down if the input voltage exceeds 42V and will restart when the voltage drops below 44V.
Thermal Management:
- The junction temperature (Tj) should be kept between -40°C and 150°C. Use appropriate heatsinking or cooling methods to manage thermal dissipation.
Thermal Resistance:
- The junction-to-ambient thermal resistance (θJA) is 50°C/W. This value helps in calculating the heat dissipation required for the device under different operating conditions.
Layout Considerations:
- Ensure that the PCB layout minimizes parasitic inductance and resistance, especially for the high-current paths.
- Place decoupling capacitors close to the power pins to reduce noise and improve stability.
Application Notes:
- Refer to the datasheet and application notes for detailed information on external component selection, PCB layout guidelines, and specific application examples.
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