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NCV7708BDWR2G

Specifications

SKU: 11221491

BUY NCV7708BDWR2G https://www.utsource.net/itm/p/11221491.html

Parameter Description Min Typ Max Unit
VIN Input Voltage 4.5 - 40 V
VOUT Output Voltage - - 36 V
IOUT Output Current - 2.5 3.0 A
fSW Switching Frequency - 500 - kHz
IQ Quiescent Current - 1.5 - mA
VUVLO Under-Voltage Lockout Threshold 4.0 - 4.3 V
VOVLO Over-Voltage Lockout Threshold 42 - 44 V
Tj Junction Temperature -40 - 150 °C
θJA Junction-to-Ambient Thermal Resistance - 50 - °C/W

Instructions for NCV7708BDWR2G:

  1. Power Supply Connection:

    • Connect the input voltage (VIN) to the power supply, ensuring it is within the range of 4.5V to 40V.
    • Ensure the output voltage (VOUT) is set appropriately for your application, not exceeding 36V.
  2. Output Current:

    • The device can deliver a continuous output current of up to 3.0A. For optimal performance, keep the output current around 2.5A.
  3. Switching Frequency:

    • The switching frequency is fixed at 500kHz. This value should be considered when designing the external components such as inductors and capacitors.
  4. Quiescent Current:

    • The quiescent current is typically 1.5mA. This is the current drawn by the device when no load is applied.
  5. Under-Voltage Lockout (UVLO):

    • The device will shut down if the input voltage drops below 4.0V and will restart when the voltage rises above 4.3V.
  6. Over-Voltage Lockout (OVLO):

    • The device will shut down if the input voltage exceeds 42V and will restart when the voltage drops below 44V.
  7. Thermal Management:

    • The junction temperature (Tj) should be kept between -40°C and 150°C. Use appropriate heatsinking or cooling methods to manage thermal dissipation.
  8. Thermal Resistance:

    • The junction-to-ambient thermal resistance (θJA) is 50°C/W. This value helps in calculating the heat dissipation required for the device under different operating conditions.
  9. Layout Considerations:

    • Ensure that the PCB layout minimizes parasitic inductance and resistance, especially for the high-current paths.
    • Place decoupling capacitors close to the power pins to reduce noise and improve stability.
  10. Application Notes:

    • Refer to the datasheet and application notes for detailed information on external component selection, PCB layout guidelines, and specific application examples.
(For reference only)

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