Specifications
SKU: 11221521
IC DRAM 64M PARALLEL 86TSOP II
Parameter | Description | Value | Unit |
---|---|---|---|
Device | IS42S32200E-6TL | ||
Type | Synchronous DRAM (SDRAM) | ||
Density | Total Memory Capacity | 32 Mbit (4 M x 8) | |
Organization | Internal Organization | 4M x 8 | |
Supply Voltage (Vcc) | Operating Supply Voltage | 3.3 | V |
Supply Voltage (Vccq) | I/O Supply Voltage | 3.3 | V |
Operating Temperature | Industrial Temperature Range | -40 to +85 | °C |
Access Time (tAC) | Access Time from Clock Edge | 6.0 | ns |
Cycle Time (tRC) | Row Cycle Time | 60.0 | ns |
Refresh Cycle Time (tREF) | Refresh Cycle Time | 64.0 | μs |
Refresh Rate | Refresh Rate | 8192 | cycles/s |
Power Consumption (Active) | Active Power Consumption | 300 | mW |
Power Consumption (Standby) | Standby Power Consumption | 5 | mW |
Package | Package Type | TQFP-48 | |
Pin Configuration | Pin Count | 48 |
Instructions for Use
Power Supply:
- Connect Vcc and Vccq to a stable 3.3V power supply.
- Ensure that the power supply has sufficient decoupling capacitors to maintain stability during high-speed switching.
Clock Signal:
- Provide a stable clock signal to the CLK pin.
- The clock frequency should be within the specified range to ensure proper operation.
Address and Data Lines:
- Connect the address lines (A0-A11) to the appropriate address bus.
- Connect the data lines (DQ0-DQ7) to the data bus.
Control Signals:
- CS# (Chip Select): Low to enable the device.
- RAS# (Row Address Strobe): Low to initiate a row address cycle.
- CAS# (Column Address Strobe): Low to initiate a column address cycle.
- WE# (Write Enable): Low to write data, high to read data.
- DQM (Data Mask): Used to mask individual data lines during write operations.
Refresh:
- Perform refresh cycles at least once every 64 microseconds to maintain data integrity.
- Use the auto-refresh command or self-refresh mode as needed.
Initialization:
- After power-up, perform a reset sequence to initialize the device.
- Follow the device-specific initialization sequence as outlined in the datasheet.
Timing:
- Ensure all timing parameters (e.g., tAC, tRC, tREF) are met to avoid data corruption and ensure reliable operation.
Thermal Management:
- Ensure adequate cooling to keep the device within the specified temperature range.
- Use heatsinks or other cooling methods if necessary.
Handling:
- Handle the device with care to avoid damage from electrostatic discharge (ESD).
- Follow ESD protection guidelines during handling and installation.
Storage:
- Store the device in a dry, cool environment to prevent moisture damage.
- Use anti-static packaging when storing or transporting the device.
For detailed information and specific application notes, refer to the official datasheet provided by the manufacturer.
(For reference only)Inquiry - IS42S32200E-6TL