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SN74LS646NT

Specifications

SKU: 11224808

BUY SN74LS646NT https://www.utsource.net/itm/p/11224808.html

Parameter Symbol Min Typ Max Unit Conditions/Notes
Supply Voltage VCC 4.75 5 5.25 V Recommended operating range
Input Voltage (High) VIH 2 - 5.25 V Minimum input voltage for logic high
Input Voltage (Low) VIL 0 - 0.8 V Maximum input voltage for logic low
Output Voltage (High) VOH 2.4 - 5.25 V Minimum output voltage for logic high at IOL = 0.4 mA
Output Voltage (Low) VOL 0 - 0.4 V Maximum output voltage for logic low at IOH = 8 mA
Propagation Delay Time tpd - 23 34 ns Typical values at VCC = 5V, TA = 25°C
Power Consumption Ptot - 150 - mW Total power dissipation per package
Operating Temperature Range TA 0 - 70 °C Commercial grade
Storage Temperature Range Tstg -65 - 150 °C Storage temperature range

Instructions for Use:

  1. Power Supply:

    • Ensure that the supply voltage (VCC) is within the recommended range of 4.75V to 5.25V.
    • Connect VCC to pin 16 and GND to pin 8.
  2. Input Signals:

    • Apply logic high (VIH) signals greater than 2V and logic low (VIL) signals less than 0.8V to the input pins.
  3. Output Signals:

    • The output pins will provide a logic high (VOH) greater than 2.4V when the input is high and a logic low (VOL) less than 0.4V when the input is low.
    • Ensure that the output current does not exceed the specified limits to avoid damage to the device.
  4. Propagation Delay:

    • The propagation delay time (tpd) is typically 23 ns at room temperature (25°C) and can vary between 23 ns and 34 ns depending on conditions.
  5. Temperature Considerations:

    • Operate the device within the commercial temperature range of 0°C to 70°C.
    • Store the device within the storage temperature range of -65°C to 150°C.
  6. Power Consumption:

    • Monitor the total power consumption to ensure it does not exceed 150 mW to prevent overheating and potential damage.
  7. Handling:

    • Handle the device with care to avoid static discharge, which can damage the sensitive components.
    • Follow proper soldering techniques to ensure reliable connections without causing thermal stress to the device.
(For reference only)

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