Specifications
SKU: 11224838
Parameter | Symbol | Min | Typ | Max | Unit | Description |
---|---|---|---|---|---|---|
Supply Voltage | VDD | 2.0 | 3.3 | 5.5 | V | Operating voltage range |
Output Current | IOUT | - | 50 | 100 | mA | Maximum output current |
Quiescent Current | IQ | 1 | 2 | 3 | μA | Current consumed by the device when active |
Shutdown Current | ISD | 0.1 | 0.5 | 1 | μA | Current consumed by the device in shutdown mode |
Operating Temperature | TOPR | -40 | - | 85 | °C | Temperature range for normal operation |
Storage Temperature | TSTG | -65 | - | 150 | °C | Temperature range for storage |
Input Capacitance | CIN | - | 4 | 6 | pF | Capacitance at input pin |
Output Capacitance | COUT | - | 10 | 22 | pF | Capacitance at output pin |
Rise Time | tr | - | 10 | 20 | ns | Time for output to rise from 10% to 90% |
Fall Time | tf | - | 10 | 20 | ns | Time for output to fall from 90% to 10% |
Propagation Delay | tpd | - | 15 | 25 | ns | Time delay between input and output |
Instructions:
Power Supply:
- Ensure the supply voltage (VDD) is within the specified range (2.0V to 5.5V).
- Use a stable power source to avoid fluctuations that could affect performance.
Output Load:
- The maximum output current (IOUT) is 100mA. Do not exceed this limit to prevent damage.
- For optimal performance, keep the load capacitance (COUT) between 10pF and 22pF.
Current Consumption:
- The quiescent current (IQ) is typically 2μA, but can range from 1μA to 3μA.
- In shutdown mode, the current consumption (ISD) is very low, typically 0.5μA, with a maximum of 1μA.
Temperature Considerations:
- The device operates normally within a temperature range of -40°C to 85°C.
- Store the device in an environment where the temperature does not exceed -65°C to 150°C.
Signal Integrity:
- Keep the input capacitance (CIN) within the range of 4pF to 6pF to ensure proper signal integrity.
- The rise time (tr) and fall time (tf) are both typically around 10ns, with a maximum of 20ns.
- The propagation delay (tpd) is typically 15ns, with a maximum of 25ns.
Handling and Installation:
- Handle the device with care to avoid static discharge, which can damage sensitive components.
- Follow standard PCB design guidelines for optimal placement and routing of the device.
Testing:
- Before finalizing the design, test the device under various conditions to ensure it meets the required specifications.
- Use appropriate test equipment to measure parameters such as output current, rise and fall times, and propagation delay.
Inquiry - HCNW137