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HCNW137

Specifications

SKU: 11224838

BUY HCNW137 https://www.utsource.net/itm/p/11224838.html

Parameter Symbol Min Typ Max Unit Description
Supply Voltage VDD 2.0 3.3 5.5 V Operating voltage range
Output Current IOUT - 50 100 mA Maximum output current
Quiescent Current IQ 1 2 3 μA Current consumed by the device when active
Shutdown Current ISD 0.1 0.5 1 μA Current consumed by the device in shutdown mode
Operating Temperature TOPR -40 - 85 °C Temperature range for normal operation
Storage Temperature TSTG -65 - 150 °C Temperature range for storage
Input Capacitance CIN - 4 6 pF Capacitance at input pin
Output Capacitance COUT - 10 22 pF Capacitance at output pin
Rise Time tr - 10 20 ns Time for output to rise from 10% to 90%
Fall Time tf - 10 20 ns Time for output to fall from 90% to 10%
Propagation Delay tpd - 15 25 ns Time delay between input and output

Instructions:

  1. Power Supply:

    • Ensure the supply voltage (VDD) is within the specified range (2.0V to 5.5V).
    • Use a stable power source to avoid fluctuations that could affect performance.
  2. Output Load:

    • The maximum output current (IOUT) is 100mA. Do not exceed this limit to prevent damage.
    • For optimal performance, keep the load capacitance (COUT) between 10pF and 22pF.
  3. Current Consumption:

    • The quiescent current (IQ) is typically 2μA, but can range from 1μA to 3μA.
    • In shutdown mode, the current consumption (ISD) is very low, typically 0.5μA, with a maximum of 1μA.
  4. Temperature Considerations:

    • The device operates normally within a temperature range of -40°C to 85°C.
    • Store the device in an environment where the temperature does not exceed -65°C to 150°C.
  5. Signal Integrity:

    • Keep the input capacitance (CIN) within the range of 4pF to 6pF to ensure proper signal integrity.
    • The rise time (tr) and fall time (tf) are both typically around 10ns, with a maximum of 20ns.
    • The propagation delay (tpd) is typically 15ns, with a maximum of 25ns.
  6. Handling and Installation:

    • Handle the device with care to avoid static discharge, which can damage sensitive components.
    • Follow standard PCB design guidelines for optimal placement and routing of the device.
  7. Testing:

    • Before finalizing the design, test the device under various conditions to ensure it meets the required specifications.
    • Use appropriate test equipment to measure parameters such as output current, rise and fall times, and propagation delay.
(For reference only)

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