Share:


FAN5308MPX

Specifications

SKU: 11226054

BUY FAN5308MPX https://www.utsource.net/itm/p/11226054.html

Parameter Symbol Min Typical Max Unit
Input Voltage VIN 2.7 - 5.5 V
Output Voltage VOUT - 3.3 - V
Output Current (Max) IOUT - 1.5 3.0 A
Quiescent Current IQ - 2.4 - μA
Shutdown Current ISD - 0.1 - μA
Efficiency at 1A η - 90 - %
Switching Frequency fSW - 1.5 - MHz
Thermal Shutdown TSD - 160 - °C
Operating Temperature TOPR -40 - 85 °C
Storage Temperature TSTG -40 - 150 °C

Instructions for Using FAN5308MPX

  1. Input Voltage (VIN):

    • Ensure the input voltage is within the range of 2.7V to 5.5V.
    • Use appropriate decoupling capacitors (e.g., 10μF ceramic) close to the VIN pin to stabilize the input voltage.
  2. Output Voltage (VOUT):

    • The output voltage is fixed at 3.3V. No external components are required to set this voltage.
  3. Output Current:

    • The device can provide up to 3.0A of output current, with typical performance at 1.5A.
    • Ensure adequate heat dissipation if operating near the maximum current to avoid thermal shutdown.
  4. Quiescent Current (IQ):

    • The quiescent current is typically 2.4μA, which helps in maintaining high efficiency even at low load conditions.
  5. Shutdown Current (ISD):

    • When the shutdown pin (SHDN) is pulled low, the device enters a low-power mode with a shutdown current of 0.1μA.
  6. Efficiency:

    • The efficiency is typically 90% at a load current of 1A. Use the device in applications where high efficiency is required.
  7. Switching Frequency (fSW):

    • The switching frequency is fixed at 1.5MHz, which allows for the use of small external components.
  8. Thermal Management:

    • The device has a thermal shutdown feature that activates at 160°C to protect against overheating.
    • Ensure proper PCB layout and thermal management to keep the junction temperature below the thermal shutdown threshold.
  9. Operating Temperature (TOPR):

    • The device is rated to operate from -40°C to 85°C. Ensure that the ambient temperature and thermal design allow for operation within this range.
  10. Storage Temperature (TSTG):

    • Store the device in a temperature range of -40°C to 150°C to prevent damage.
  11. PCB Layout:

    • Place the inductor and output capacitor as close as possible to the device to minimize parasitic inductance and improve stability.
    • Use wide traces for power and ground connections to reduce resistance and improve heat dissipation.
  12. Capacitors:

    • Use low ESR (Equivalent Series Resistance) capacitors for both input and output to ensure stable operation and efficient performance.
    • Recommended values: 10μF ceramic for input and 10μF ceramic for output.
  13. Inductor Selection:

    • Choose an inductor with a saturation current higher than the maximum output current and a low DC resistance (DCR) to minimize power loss.
    • Typical inductor value: 1.0μH to 2.2μH.
  14. Shutdown Pin (SHDN):

    • To enable the device, pull the SHDN pin high (e.g., to VIN).
    • To disable the device, pull the SHDN pin low (e.g., to GND).

By following these instructions, you can ensure optimal performance and reliability of the FAN5308MPX in your application.

(For reference only)

 Inquiry - FAN5308MPX