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IRFP3710PBF

Specifications

SKU: 11226120

BUY IRFP3710PBF https://www.utsource.net/itm/p/11226120.html

Parameter Symbol Min Typical Max Unit Condition
Drain-Source Voltage VDS - - 550 V -
Gate-Source Voltage VGS -20 - 20 V -
Continuous Drain Current ID - 24 - A TC = 25°C
Continuous Drain Current ID - 18 - A TC = 100°C
Pulse Drain Current IDM - 60 - A tp = 10 μs, IG = 10 A
Power Dissipation PTOT - - 190 W TC = 25°C
Junction Temperature TJ - - 175 °C -
Storage Temperature TSTG -55 - 150 °C -

Instructions for Use:

  1. Handling Precautions:

    • ESD Sensitivity: The IRFP3710PBF is sensitive to electrostatic discharge (ESD). Use proper ESD protection measures during handling and installation.
    • Gate Protection: Avoid applying voltages outside the specified range to the gate. Use appropriate clamping diodes or resistors if necessary.
  2. Thermal Management:

    • Heat Sinking: Ensure adequate heat sinking to keep the junction temperature within the specified limits, especially under high current or continuous operation.
    • Thermal Resistance: The thermal resistance from the junction to the case (RθJC) is typically 0.55°C/W. Use this value for thermal calculations.
  3. Electrical Characteristics:

    • Drain-Source On-Resistance (RDS(on)): The on-resistance is typically 0.18 Ω at VGS = 10 V and ID = 24 A. Ensure that the gate voltage is sufficient to fully turn on the MOSFET.
    • Threshold Voltage (VGS(th)): The threshold voltage is typically 4 V at ID = 250 μA. This is the minimum gate-source voltage required to start conducting current.
  4. Mounting:

    • Surface Mount: If using surface mount technology, follow the recommended soldering profile to avoid damage to the device.
    • Through-Hole: For through-hole mounting, ensure that the leads are properly aligned and soldered without excessive heat.
  5. Testing:

    • Initial Testing: After installation, perform initial testing to verify the correct operation of the MOSFET. Check for proper gate drive and drain-source voltage/current levels.
    • Periodic Testing: Conduct periodic testing to ensure the device is operating within its specifications and to detect any potential issues early.
  6. Storage:

    • Dry Environment: Store the IRFP3710PBF in a dry environment to prevent moisture absorption, which can lead to damage during soldering.
    • Static-Free Area: Store the device in a static-free area to prevent ESD damage.

By following these guidelines, you can ensure reliable and efficient operation of the IRFP3710PBF in your application.

(For reference only)

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