Specifications
SKU: 11226120
Parameter | Symbol | Min | Typical | Max | Unit | Condition |
---|---|---|---|---|---|---|
Drain-Source Voltage | VDS | - | - | 550 | V | - |
Gate-Source Voltage | VGS | -20 | - | 20 | V | - |
Continuous Drain Current | ID | - | 24 | - | A | TC = 25°C |
Continuous Drain Current | ID | - | 18 | - | A | TC = 100°C |
Pulse Drain Current | IDM | - | 60 | - | A | tp = 10 μs, IG = 10 A |
Power Dissipation | PTOT | - | - | 190 | W | TC = 25°C |
Junction Temperature | TJ | - | - | 175 | °C | - |
Storage Temperature | TSTG | -55 | - | 150 | °C | - |
Instructions for Use:
Handling Precautions:
- ESD Sensitivity: The IRFP3710PBF is sensitive to electrostatic discharge (ESD). Use proper ESD protection measures during handling and installation.
- Gate Protection: Avoid applying voltages outside the specified range to the gate. Use appropriate clamping diodes or resistors if necessary.
Thermal Management:
- Heat Sinking: Ensure adequate heat sinking to keep the junction temperature within the specified limits, especially under high current or continuous operation.
- Thermal Resistance: The thermal resistance from the junction to the case (RθJC) is typically 0.55°C/W. Use this value for thermal calculations.
Electrical Characteristics:
- Drain-Source On-Resistance (RDS(on)): The on-resistance is typically 0.18 Ω at VGS = 10 V and ID = 24 A. Ensure that the gate voltage is sufficient to fully turn on the MOSFET.
- Threshold Voltage (VGS(th)): The threshold voltage is typically 4 V at ID = 250 μA. This is the minimum gate-source voltage required to start conducting current.
Mounting:
- Surface Mount: If using surface mount technology, follow the recommended soldering profile to avoid damage to the device.
- Through-Hole: For through-hole mounting, ensure that the leads are properly aligned and soldered without excessive heat.
Testing:
- Initial Testing: After installation, perform initial testing to verify the correct operation of the MOSFET. Check for proper gate drive and drain-source voltage/current levels.
- Periodic Testing: Conduct periodic testing to ensure the device is operating within its specifications and to detect any potential issues early.
Storage:
- Dry Environment: Store the IRFP3710PBF in a dry environment to prevent moisture absorption, which can lead to damage during soldering.
- Static-Free Area: Store the device in a static-free area to prevent ESD damage.
By following these guidelines, you can ensure reliable and efficient operation of the IRFP3710PBF in your application.
(For reference only)Inquiry - IRFP3710PBF