Share:


SGL160N60UFD

Specifications

SKU: 11226128

BUY SGL160N60UFD https://www.utsource.net/itm/p/11226128.html

Parameter Symbol Min Typ Max Unit
Drain-Source Voltage VDS -60 - -100 V
Gate-Source Voltage VGS -20 - 20 V
Continuous Drain Current ID - 160 - A
Pulse Drain Current IDpeak - 320 - A
Power Dissipation PD - - 250 W
Junction Temperature TJ -55 - 175 °C
Storage Temperature TSTG -55 - 150 °C

Instructions for Use

  1. Handling Precautions:

    • Handle the SGL160N60UFD with care to avoid damage to the leads and the body.
    • Use proper ESD (Electrostatic Discharge) protection when handling the device to prevent damage from static electricity.
  2. Mounting:

    • Ensure that the mounting surface is clean and flat.
    • Apply thermal paste or a thermal pad between the device and the heatsink to improve heat dissipation.
    • Secure the device using recommended torque values for the mounting screws to ensure good thermal contact without causing mechanical stress.
  3. Electrical Connections:

    • Connect the drain (D), source (S), and gate (G) terminals correctly.
    • Use short and thick wires to minimize inductance and resistance.
    • Ensure that the gate drive circuit is designed to provide sufficient drive current and voltage to switch the MOSFET quickly and efficiently.
  4. Thermal Management:

    • Monitor the junction temperature (TJ) to ensure it does not exceed the maximum rating of 175°C.
    • Use a heatsink with adequate thermal capacity and cooling (e.g., forced air, liquid cooling) to maintain the device within safe operating temperatures.
  5. Operating Conditions:

    • Do not exceed the maximum ratings for drain-source voltage (VDS), gate-source voltage (VGS), and continuous drain current (ID).
    • Ensure that the power dissipation (PD) is within the rated limits by providing adequate cooling.
  6. Storage:

    • Store the device in a dry, cool place away from direct sunlight and sources of heat.
    • Keep the device in its original packaging until ready for use to protect against moisture and physical damage.
  7. Testing:

    • Before installing the device in a circuit, perform a continuity test to ensure there are no short circuits or open circuits.
    • Test the device under controlled conditions to verify its performance and reliability.
  8. Disposal:

    • Dispose of the device according to local environmental regulations and guidelines for electronic waste.

For more detailed information, refer to the datasheet provided by the manufacturer.

(For reference only)

 Inquiry - SGL160N60UFD