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G160N60UFD

Specifications

SKU: 11226129

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Parameter Description Value Unit
Part Number Device Identifier G160N60UFD -
Type Device Type N-Channel MOSFET -
VDS (Max) Drain-to-Source Voltage 600 V
VGS (Max) Gate-to-Source Voltage ±20 V
ID (Max) Continuous Drain Current 160 A
PTOT (Max) Total Power Dissipation 340 W
RDS(on) (Typical) On-State Resistance at VGS = 10V 2.5
QG (Total) Total Gate Charge 320 nC
QGD (Drain) Gate-to-Drain Charge 100 nC
QGS (Source) Gate-to-Source Charge 70 nC
td(on) Turn-On Delay Time 25 ns
tr Rise Time 45 ns
td(off) Turn-Off Delay Time 35 ns
tf Fall Time 60 ns
fT Transition Frequency 1.8 MHz
Operating Temperature Range Junction Temperature -55 to +175 °C
Storage Temperature Range Storage Temperature -65 to +175 °C
Package Package Type TO-247-3L -

Instructions for Use:

  1. Mounting:

    • Ensure proper heat sinking to manage the high power dissipation.
    • Use a thermal compound between the MOSFET and the heatsink for optimal heat transfer.
  2. Biasing:

    • Apply a gate-to-source voltage (VGS) within the specified range to control the MOSFET.
    • Avoid exceeding the maximum VGS to prevent damage to the device.
  3. Current Handling:

    • Do not exceed the continuous drain current (ID) rating to avoid overheating and potential failure.
    • Consider derating the current based on ambient temperature and cooling conditions.
  4. Switching:

    • Minimize switching losses by ensuring fast turn-on and turn-off times.
    • Use appropriate gate drive circuits to achieve the required switching speeds.
  5. Storage and Handling:

    • Store the device in a dry, cool environment within the specified storage temperature range.
    • Handle with care to avoid mechanical damage and static discharge.
  6. Testing:

    • Use a suitable test setup to verify the parameters before integrating into the final application.
    • Refer to the datasheet for detailed testing procedures and recommended test conditions.
(For reference only)

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