Specifications
SKU: 11228270
Parameter | Symbol | Value | Unit |
---|---|---|---|
Drain-Source Voltage | V(DS) | 150 | V |
Gate-Source Voltage | V(GS) | ±20 | V |
Continuous Drain Current | I(D) | 10 | A |
Pulse Drain Current | I(DM) | 30 | A |
Power Dissipation | P(TOT) | 120 | W |
Junction Temperature | T(J) | -55 to +175 | °C |
Storage Temperature | T(STG) | -55 to +150 | °C |
Instructions for Use:
Handling Precautions:
- Handle the 2SK2632LS with care to avoid mechanical damage.
- Use ESD (Electrostatic Discharge) protection to prevent damage from static electricity.
Mounting:
- Ensure proper heat sinking to manage the power dissipation and maintain the junction temperature within the specified range.
- Use recommended mounting torque for the screws to ensure good thermal contact without causing damage.
Biasing:
- Apply the gate-source voltage (V(GS)) carefully, ensuring it does not exceed the maximum ratings.
- The drain-source voltage (V(DS)) should also be kept within the specified limits to avoid breakdown.
Current Limiting:
- Use appropriate current-limiting resistors or circuits to prevent the continuous drain current (I(D)) from exceeding 10A.
- For pulse applications, ensure that the pulse drain current (I(DM)) does not exceed 30A.
Thermal Management:
- Monitor the junction temperature (T(J)) to ensure it remains between -55°C and +175°C.
- Use thermal management techniques such as heatsinks, fans, or cooling systems to maintain optimal operating temperatures.
Storage:
- Store the 2SK2632LS in a dry, cool place with temperatures between -55°C and +150°C.
- Avoid exposure to high humidity and corrosive environments.
Testing:
- Perform initial testing at low power levels to verify correct operation before applying full load conditions.
- Regularly inspect the device for signs of wear or damage during operation and maintenance.
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