Share:
Specifications
SKU: 11229176
| Parameter | Symbol | Min | Typ | Max | Unit | Notes |
|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | - | 500 | - | V | |
| Gate-Source Voltage | VGS | -20 | 0 | 20 | V | |
| Continuous Drain Current (Tc = 25°C) | ID(25°C) | - | 18 | - | A | |
| Continuous Drain Current (Tc = 100°C) | ID(100°C) | - | 12 | - | A | |
| Pulse Drain Current (Tc = 25°C, 10 μs) | IDM(25°C) | - | 60 | - | A | |
| Power Dissipation (Tc = 25°C) | Ptot(25°C) | - | 180 | - | W | |
| Junction Temperature | TJ | - | - | 150 | °C | |
| Storage Temperature Range | TSTG | -55 | - | 150 | °C | |
| Thermal Resistance, Junction to Case | RthJC | - | 0.7 | - | °C/W | |
| Total Gate Charge | QG | - | 44 | - | nC | |
| Input Capacitance | Ciss | - | 1650 | - | pF | |
| Output Capacitance | Coss | - | 340 | - | pF | |
| Reverse Transfer Capacitance | Crss | - | 120 | - | pF |
Instructions for Use:
Voltage Ratings:
- Ensure that the drain-source voltage (VDS) does not exceed 500V.
- The gate-source voltage (VGS) should be within -20V to +20V.
Current Ratings:
- The continuous drain current (ID) at 25°C is 18A, and at 100°C it is 12A.
- For pulse conditions, the maximum drain current (IDM) is 60A for a 10 μs pulse at 25°C.
Power Dissipation:
- The power dissipation (Ptot) at 25°C is 180W.
Temperature Considerations:
- The junction temperature (TJ) should not exceed 150°C.
- Store the device within the temperature range of -55°C to 150°C.
Thermal Management:
- The thermal resistance from the junction to the case (RthJC) is 0.7°C/W. Ensure adequate heat sinking to manage thermal dissipation.
Capacitance and Charge:
- Be aware of the input capacitance (Ciss), output capacitance (Coss), and reverse transfer capacitance (Crss) for circuit design and switching performance optimization.
Handling:
- Handle the device with care to avoid damage to the leads and the die.
- Follow ESD (Electrostatic Discharge) precautions to prevent damage to the device.
Mounting:
- Ensure proper mounting to the PCB to maintain mechanical stability and thermal performance.
- Use recommended soldering profiles to avoid thermal shock during assembly.
Testing:
- Test the device under controlled conditions to verify its performance and reliability before final integration into the system.
Inquiry - MDF18N50BTH
