Instructions for Use:

1. Handling Precautions:

   • Handle the 2SK2698 with care to avoid damage to the leads and the die.
   • Use ESD (Electrostatic Discharge) protection when handling the device to prevent damage from static electricity.

2. Mounting:

   • Ensure proper heat sinking to manage the thermal resistance and keep the junction temperature within safe limits.
   • Use a heatsink with adequate thermal conductivity and surface area to dissipate the heat generated by the device.

3. Biasing:

   • Apply the gate-source voltage (V_GS) carefully to avoid exceeding the maximum ratings.
   • Ensure that the gate-source voltage is within the specified range to prevent gate oxide breakdown.

4. Current Limiting:

   • Do not exceed the continuous or pulse drain current ratings.
   • Use external current limiting components if necessary to protect the device from overcurrent conditions.

5. Temperature Management:

   • Monitor the junction temperature to ensure it does not exceed 175°C.
   • Consider derating the power dissipation if operating in high ambient temperatures.

6. Storage:

   • Store the 2SK2698 in a dry, cool environment within the specified storage temperature range.
   • Avoid exposure to corrosive environments and extreme humidity.

7. Testing:

   • Perform initial testing under controlled conditions to verify the performance and reliability of the device.
   • Use appropriate test equipment and methods to accurately measure the parameters and performance characteristics.