Instructions for Use:

1. Mounting and Handling:

   • Ensure proper heat sinking to manage the power dissipation and maintain the junction temperature within safe limits.
   • Handle the device with care to avoid damage to the gate, which is sensitive to electrostatic discharge (ESD).

2. Biasing:

   • Apply the appropriate gate-source voltage (V_GS) to control the drain current (I_D). The typical operating range is from 0 V to 15 V.
   • Avoid exceeding the maximum gate-source voltage (±20 V) to prevent damage.

3. Current Limiting:

   • Ensure that the continuous drain current does not exceed 33 A at 25°C or 20 A at 100°C to prevent overheating and potential failure.
   • For pulse operation, do not exceed 90 A for pulses of 10 ms duration.

4. Thermal Management:

   • Monitor the junction temperature (T_J) to ensure it does not exceed 175°C.
   • Use thermal paste and a heatsink to improve heat dissipation.

5. Storage:

   • Store the device in a dry environment with temperatures between -55°C and 150°C to avoid degradation.

6. Testing:

   • Before installing the device in a circuit, perform a continuity check to ensure there are no short circuits or open circuits.
   • Use a low-voltage power supply to test the device under controlled conditions to avoid damage.

7. Safety:

   • Always follow safety guidelines when working with high voltages and currents.
   • Use appropriate protective equipment and grounding techniques to prevent ESD damage.