Name: IRFB20N50K
Availability: InStock

IRFB20N50K

Category: Elec-component, IC Chips

Specifications

SKU: 11232834

BUY IRFB20N50K https://www.utsource.net/itm/p/11232834.html

Parameter	Symbol	Min	Typical	Max	Unit	Notes
Maximum Drain Voltage	V_DSS	-	-	500	V
Maximum Gate-Source Voltage	V_GSS	-15	-	15	V
Maximum Continuous Drain Current	I_D	-	-	20	A	@ T_C = 25°C
Maximum Pulse Drain Current	I_DM	-	-	60	A	@ T_C = 25°C, t_pw = 10 μs
Maximum Total Power Dissipation	P_TOT	-	-	180	W	@ T_C = 25°C
Junction Temperature	T_J	-	-	175	°C
Storage Temperature Range	T_STG	-55	-	150	°C
Thermal Resistance, Junction to Case	R_θJC	-	0.5	-	°C/W
Drain-Source On-State Resistance	R_DS(on)	-	0.17	-	Ω	@ V_GS = 10V, I_D = 10A
Input Capacitance	C_iss	-	2400	-	pF	@ V_DS = 300V, f = 1 MHz
Output Capacitance	C_oss	-	650	-	pF	@ V_DS = 300V, f = 1 MHz
Reverse Transfer Capacitance	C_rss	-	260	-	pF	@ V_DS = 300V, f = 1 MHz
Gate Charge	Q_G	-	67	-	nC	@ V_DS = 300V, I_D = 10A
Turn-On Delay Time	t_d(on)	-	26	-	ns	@ V_GS = 10V, I_D = 10A
Rise Time	t_r	-	45	-	ns	@ V_GS = 10V, I_D = 10A
Turn-Off Delay Time	t_d(off)	-	19	-	ns	@ V_GS = 10V, I_D = 10A
Fall Time	t_f	-	45	-	ns	@ V_GS = 10V, I_D = 10A

Handling and Storage:
- Store in a dry, cool place.
- Handle with care to avoid damage to the leads and the body of the device.
Mounting:
- Ensure proper heat sinking to manage thermal resistance and maintain junction temperature within safe limits.
- Use appropriate mounting hardware and thermal paste to ensure good thermal contact.
Electrical Connections:
- Connect the drain (D), source (S), and gate (G) terminals correctly.
- Use short, low-inductance leads to minimize parasitic effects.
Biasing:
- Apply a gate-source voltage (V_GS) of at least 10V to ensure full enhancement and minimum R_DS(on).
- Ensure that the gate-source voltage does not exceed the maximum ratings to avoid damage.
Operation:
- Operate within the specified current and voltage limits.
- Monitor the junction temperature to prevent overheating.
- Use appropriate snubber circuits if switching high inductive loads to suppress voltage spikes.
Testing:
- Test the device under controlled conditions to verify its performance.
- Use a suitable power supply and load to simulate actual operating conditions.
Safety:
- Follow all safety guidelines when handling high-voltage and high-current circuits.
- Use appropriate protective equipment and grounding techniques to prevent electrical shock.

(For reference only)

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