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Specifications
SKU: 11232838
| Parameter | Symbol | Test Conditions | Min | Typical | Max | Unit |
|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | - | -55 | - | 55 | V |
| Gate-Source Voltage | VGS | - | -20 | - | 20 | V |
| Continuous Drain Current | ID | TC = 25°C | - | - | 68 | A |
| Continuous Drain Current | ID | TC = 100°C | - | - | 48 | A |
| Pulse Drain Current | IDpeak | tp = 10 μs, IG = 10 A | - | - | 160 | A |
| Power Dissipation | PD | TC = 25°C | - | - | 320 | W |
| Junction Temperature | TJ | - | - | - | 175 | °C |
| Storage Temperature Range | TSTG | - | -65 | - | 150 | °C |
| Total Device Dissipation | PTOT | - | - | - | 320 | W |
Instructions for Use:
Handling Precautions:
- ESD Sensitivity: The IRFB7430 is sensitive to electrostatic discharge (ESD). Handle with care and use proper ESD protection equipment.
- Thermal Management: Ensure adequate heat sinking to manage the power dissipation, especially at high current levels.
Mounting:
- Surface Mount Technology (SMT): Follow recommended soldering profiles to avoid thermal shock and ensure good thermal and electrical connections.
- Through-Hole Mounting: Ensure proper alignment and secure mounting to prevent mechanical stress on the device.
Biasing:
- Gate-Source Voltage (VGS): Apply the gate-source voltage within the specified limits to avoid damage to the device.
- Gate Drive: Use a low-impedance driver to minimize switching losses and ensure fast turn-on and turn-off times.
Operation:
- Drain-Source Voltage (VDS): Do not exceed the maximum drain-source voltage to prevent breakdown.
- Continuous Drain Current (ID): Operate within the continuous drain current ratings to avoid overheating and potential failure.
- Pulse Drain Current (IDpeak): For pulse applications, ensure the pulse duration and frequency are within the specified limits to avoid exceeding the maximum power dissipation.
Thermal Considerations:
- Junction Temperature (TJ): Monitor the junction temperature to ensure it does not exceed the maximum rating. Use appropriate heat sinks or cooling methods as necessary.
- Power Dissipation (PD): Calculate the power dissipation based on the operating conditions and ensure it is within the safe operating area.
Storage:
- Storage Temperature Range (TSTG): Store the device in a dry, cool environment within the specified storage temperature range to maintain its reliability and performance.
Testing:
- Parameter Testing: Verify the device parameters using the test conditions specified in the table to ensure the device meets the required specifications.
For detailed application notes and further information, refer to the datasheet provided by the manufacturer.
(For reference only)Inquiry - IRFB7430
