Share:


IR2133JPBF

Specifications

SKU: 11232891

BUY IR2133JPBF https://www.utsource.net/itm/p/11232891.html

Parameter Symbol Min Typ Max Unit Description
Supply Voltage VDD 10 - 20 V Operating supply voltage range
Under-Voltage Lockout UVLO 9.5 - 10 V Threshold for under-voltage lockout
High-Side Floating Range VB - VS 0 - 600 V Maximum high-side floating voltage
Gate Drive Output VGS 10 - 20 V Gate drive output voltage
Gate Drive Current IG -1 - 1 A Peak gate drive current (source/sink)
Propagation Delay td 80 - 150 ns Propagation delay time
Dead Time tdead 50 - 150 ns Minimum dead time between high-side and low-side outputs
Operating Temperature TA -40 - 125 °C Ambient operating temperature range
Storage Temperature TSTG -55 - 150 °C Storage temperature range

Instructions for Using IR2133JPBF

  1. Supply Voltage:

    • Ensure the supply voltage (VDD) is within the specified range of 10V to 20V.
    • The under-voltage lockout (UVLO) will activate if the supply voltage drops below 9.5V, disabling the device to prevent damage.
  2. High-Side Floating:

    • The high-side driver can operate with a floating voltage (VB - VS) up to 600V, allowing it to control high-side MOSFETs in various applications.
  3. Gate Drive:

    • The gate drive output voltage (VGS) should be set between 10V and 20V to ensure proper operation of the MOSFETs.
    • The peak gate drive current (IG) can source or sink up to 1A, which is sufficient for driving most power MOSFETs.
  4. Timing Parameters:

    • The propagation delay (td) is typically between 80ns and 150ns, which affects the switching speed of the MOSFETs.
    • The minimum dead time (tdead) between high-side and low-side outputs is 50ns to 150ns to prevent shoot-through conditions.
  5. Temperature Considerations:

    • The ambient operating temperature (TA) should be within -40°C to 125°C to ensure reliable operation.
    • Store the device in an environment where the temperature ranges from -55°C to 150°C to avoid damage during storage.
  6. Layout and PCB Design:

    • Use short, wide traces for the gate drive signals to minimize parasitic inductance and improve performance.
    • Place decoupling capacitors close to the VDD and VSS pins to ensure stable operation and reduce noise.
  7. Protection:

    • Implement appropriate protection circuits, such as overvoltage and overcurrent protection, to safeguard the device and connected components.

By following these guidelines, you can effectively use the IR2133JPBF in your power electronics designs.

(For reference only)

 Inquiry - IR2133JPBF