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MC56F8014VFAE

Specifications

SKU: 11241522

BUY MC56F8014VFAE https://www.utsource.net/itm/p/11241522.html

Parameter Description Min Typ Max Unit
VDD Supply Voltage 2.7 - 5.5 V
VIO I/O Supply Voltage 2.7 - 5.5 V
fCLK Clock Frequency - 40 80 MHz
Tj Junction Temperature -40 - 125 °C
IOL Output Low Current - 4 - mA
IOH Output High Current - -4 - mA
IIN Input Leakage Current - 1 - μA
tPD Propagation Delay - 12.5 25 ns
tSU Setup Time - 3 6 ns
tH Hold Time - 1 3 ns
tR Rise Time - 3 6 ns
tF Fall Time - 3 6 ns
PSRR Power Supply Rejection Ratio - 60 - dB
CMRR Common Mode Rejection Ratio - 80 - dB

Instructions for MC56F8014VFAE

  1. Supply Voltage (VDD and VIO):

    • Ensure that the supply voltage is within the range of 2.7V to 5.5V.
    • Use appropriate decoupling capacitors (0.1μF and 10μF) close to the power pins to reduce noise and stabilize the supply.
  2. Clock Frequency (fCLK):

    • The device supports clock frequencies from 40MHz to 80MHz. Use a stable oscillator or clock source to ensure accurate timing.
  3. Temperature Range (Tj):

    • The junction temperature should be maintained between -40°C and 125°C to ensure reliable operation.
  4. Output Current (IOL and IOH):

    • The output low current (IOL) can sink up to 4mA.
    • The output high current (IOH) can source up to -4mA.
  5. Input Leakage Current (IIN):

    • The input leakage current should not exceed 1μA.
  6. Propagation Delay (tPD):

    • The typical propagation delay is 12.5ns with a maximum of 25ns.
  7. Setup and Hold Times (tSU and tH):

    • Ensure that the setup time (tSU) is at least 3ns and the hold time (tH) is at least 1ns.
  8. Rise and Fall Times (tR and tF):

    • The rise time (tR) and fall time (tF) should be between 3ns and 6ns.
  9. Power Supply Rejection Ratio (PSRR):

    • The device has a typical PSRR of 60dB, which helps in rejecting noise from the power supply.
  10. Common Mode Rejection Ratio (CMRR):

    • The device has a typical CMRR of 80dB, which helps in rejecting common mode noise.

Additional Notes:

  • Always refer to the datasheet for detailed information and specific application notes.
  • Proper PCB layout and grounding techniques are crucial for optimal performance and reliability.
  • For high-frequency applications, consider using controlled impedance traces and proper termination techniques to minimize signal reflections and crosstalk.
(For reference only)

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