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SN74LS367AN

Specifications

SKU: 11242657

BUY SN74LS367AN https://www.utsource.net/itm/p/11242657.html
IC BUF NON-INVERT 5.25V 16DIP
Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage VCC - 4.75 5.0 5.25 V
Input Voltage (High Level) VIH - 2.0 - 5.0 V
Input Voltage (Low Level) VIL - 0.0 - 0.8 V
Output Voltage (High Level) VOH IOL = 0.4 mA 2.4 - 5.0 V
Output Voltage (Low Level) VOL IOH = 16 mA 0.0 - 0.5 V
Input Current (High Level) IIH VI = 5.0 V -0.04 - - mA
Input Current (Low Level) IIL VI = 0.0 V -0.4 - - mA
Output Current (High Level) IOH VO = 2.4 V -0.4 - - mA
Output Current (Low Level) IOL VO = 0.4 V -16 - - mA
Propagation Delay Time tpd VCC = 5.0 V, TA = 25°C 12 - 18 ns
Power Dissipation PD Per Package - - 500 mW

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the range of 4.75 V to 5.25 V.
    • Connect the ground (GND) pin to a stable 0 V reference.
  2. Input Signals:

    • For a high input level, ensure the input voltage (VIH) is between 2.0 V and 5.0 V.
    • For a low input level, ensure the input voltage (VIL) is between 0.0 V and 0.8 V.
    • Be aware of the input current requirements:
      • High-level input current (IIH) should not exceed -0.04 mA.
      • Low-level input current (IIL) should not exceed -0.4 mA.
  3. Output Signals:

    • For a high output level, the output voltage (VOH) will be between 2.4 V and 5.0 V when the output current (IOH) is 0.4 mA.
    • For a low output level, the output voltage (VOL) will be between 0.0 V and 0.5 V when the output current (IOL) is 16 mA.
  4. Propagation Delay:

    • The propagation delay time (tpd) is the time it takes for the output to change state after the input changes. At a supply voltage of 5.0 V and ambient temperature of 25°C, the typical propagation delay is 12 to 18 ns.
  5. Power Dissipation:

    • The maximum power dissipation per package is 500 mW. Ensure proper heat dissipation if operating near this limit.
  6. Handling:

    • Handle the device with care to avoid static damage. Use appropriate ESD protection measures.
  7. Storage:

    • Store the device in a dry, cool place to prevent moisture damage. Follow the storage guidelines provided by the manufacturer.
  8. Testing:

    • Before integrating the device into your circuit, test its functionality using a breadboard or a similar setup to ensure it meets the required specifications.

For more detailed information, refer to the datasheet provided by Texas Instruments or the specific manufacturer.

(For reference only)

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