Specifications
SKU: 11243299
Parameter | Symbol | Min | Typ | Max | Unit | Notes |
---|---|---|---|---|---|---|
Input Voltage | VIN | 4.5 | - | 36 | V | |
Output Voltage | VOUT | 1.0 | - | 5.5 | V | Adjustable |
Output Current | IOUT | - | 6 | - | A | Continuous |
Efficiency | η | - | 92 | - | % | Typical at full load |
Switching Frequency | fSW | - | 600 | - | kHz | Fixed |
Quiescent Current | IQ | - | 25 | - | μA | Shutdown mode |
Shutdown Current | ISD | - | 1 | - | μA | |
Thermal Shutdown | TSD | - | 160 | - | °C | Typical |
Operating Temperature | TOP | -40 | - | 125 | °C | |
Storage Temperature | TSTG | -55 | - | 150 | °C | |
Package | - | - | - | - | SOIC-8 |
Instructions:
Input Voltage (VIN):
- Ensure the input voltage is within the range of 4.5V to 36V.
- Do not exceed the maximum input voltage to avoid damage to the device.
Output Voltage (VOUT):
- The output voltage can be adjusted between 1.0V and 5.5V using external resistors.
- Use the formula: VOUT = VREF * (1 + R2/R1), where VREF is typically 0.8V.
Output Current (IOUT):
- The device can provide up to 6A of continuous output current.
- Ensure proper heat dissipation if operating at high currents.
Efficiency (η):
- The typical efficiency is 92% at full load.
- Efficiency can vary based on input and output voltages, as well as load conditions.
Switching Frequency (fSW):
- The switching frequency is fixed at 600kHz.
- This helps in reducing the size of external components like inductors and capacitors.
Quiescent Current (IQ):
- The quiescent current is typically 25μA.
- In shutdown mode, the current drops to approximately 1μA.
Thermal Shutdown (TSD):
- The device will shut down if the junction temperature exceeds 160°C to prevent damage.
- Ensure adequate cooling for high-power applications.
Operating Temperature (TOP):
- The device can operate over a temperature range of -40°C to 125°C.
- Ensure the ambient temperature is within this range.
Storage Temperature (TSTG):
- Store the device in a temperature range of -55°C to 150°C.
- Avoid exposing the device to extreme temperatures for extended periods.
Package:
- The device is packaged in an SOIC-8 package.
- Follow standard PCB design guidelines for proper mounting and soldering.
Inquiry - SRM2264LC12