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SRM2264LC12

Specifications

SKU: 11243299

BUY SRM2264LC12 https://www.utsource.net/itm/p/11243299.html

Parameter Symbol Min Typ Max Unit Notes
Input Voltage VIN 4.5 - 36 V
Output Voltage VOUT 1.0 - 5.5 V Adjustable
Output Current IOUT - 6 - A Continuous
Efficiency η - 92 - % Typical at full load
Switching Frequency fSW - 600 - kHz Fixed
Quiescent Current IQ - 25 - μA Shutdown mode
Shutdown Current ISD - 1 - μA
Thermal Shutdown TSD - 160 - °C Typical
Operating Temperature TOP -40 - 125 °C
Storage Temperature TSTG -55 - 150 °C
Package - - - - SOIC-8

Instructions:

  1. Input Voltage (VIN):

    • Ensure the input voltage is within the range of 4.5V to 36V.
    • Do not exceed the maximum input voltage to avoid damage to the device.
  2. Output Voltage (VOUT):

    • The output voltage can be adjusted between 1.0V and 5.5V using external resistors.
    • Use the formula: VOUT = VREF * (1 + R2/R1), where VREF is typically 0.8V.
  3. Output Current (IOUT):

    • The device can provide up to 6A of continuous output current.
    • Ensure proper heat dissipation if operating at high currents.
  4. Efficiency (η):

    • The typical efficiency is 92% at full load.
    • Efficiency can vary based on input and output voltages, as well as load conditions.
  5. Switching Frequency (fSW):

    • The switching frequency is fixed at 600kHz.
    • This helps in reducing the size of external components like inductors and capacitors.
  6. Quiescent Current (IQ):

    • The quiescent current is typically 25μA.
    • In shutdown mode, the current drops to approximately 1μA.
  7. Thermal Shutdown (TSD):

    • The device will shut down if the junction temperature exceeds 160°C to prevent damage.
    • Ensure adequate cooling for high-power applications.
  8. Operating Temperature (TOP):

    • The device can operate over a temperature range of -40°C to 125°C.
    • Ensure the ambient temperature is within this range.
  9. Storage Temperature (TSTG):

    • Store the device in a temperature range of -55°C to 150°C.
    • Avoid exposing the device to extreme temperatures for extended periods.
  10. Package:

    • The device is packaged in an SOIC-8 package.
    • Follow standard PCB design guidelines for proper mounting and soldering.
(For reference only)

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