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Specifications
SKU: 11244367
| Parameter | Symbol | Value | Unit | Description |
|---|---|---|---|---|
| Maximum Drain-Source Voltage | VDS(max) | 600 | V | Maximum voltage that can be applied between drain and source. |
| Maximum Gate-Source Voltage | VGS(max) | ±20 | V | Maximum voltage that can be applied between gate and source. |
| Maximum Drain Current (Pulsed) | ID(max) | 75 | A | Maximum pulsed drain current. |
| Maximum Continuous Drain Current | ID(on) | 40 | A | Maximum continuous drain current at TC = 25°C. |
| Maximum Power Dissipation | PD | 180 | W | Maximum power dissipation at TC = 25°C. |
| Junction Temperature Range | TJ | -55 to +175 | °C | Operating temperature range for the junction. |
| Storage Temperature Range | TSTG | -55 to +175 | °C | Temperature range for storage. |
| Total Gate Charge | QG | 130 | nC | Total gate charge at VGS = 15V, ID = 40A. |
| Input Capacitance | Ciss | 2900 | pF | Input capacitance at VDS = 400V, VGS = 0V. |
| Output Capacitance | Coss | 450 | pF | Output capacitance at VDS = 400V, VGS = 0V. |
| Reverse Transfer Capacitance | Crss | 350 | pF | Reverse transfer capacitance at VDS = 400V, VGS = 0V. |
| On-State Resistance | RDS(on) | 0.18 | Ω | On-state resistance at VGS = 10V, ID = 40A. |
Instructions:
Handling Precautions:
- Handle the FGY75N60SMD with care to avoid damage to the leads and body.
- Use proper ESD (Electrostatic Discharge) protection when handling to prevent damage from static electricity.
Mounting:
- Ensure proper heat sinking to manage the maximum power dissipation.
- Follow recommended PCB layout guidelines to minimize parasitic inductances and ensure reliable operation.
Operating Conditions:
- Do not exceed the maximum ratings listed in the table.
- Operate within the specified junction temperature range to avoid thermal runaway.
Gate Drive:
- Use a gate resistor to control the switching speed and reduce electromagnetic interference (EMI).
- Ensure the gate drive circuit provides sufficient voltage and current to fully turn on and off the MOSFET.
Storage:
- Store the device in a dry, cool place within the specified storage temperature range.
- Avoid exposure to corrosive environments or high humidity.
Testing:
- Perform initial testing under controlled conditions to verify the device parameters and functionality.
- Use appropriate test equipment and follow safety guidelines to prevent damage to the device or injury.
Soldering:
- Use a temperature-controlled soldering iron and follow the recommended soldering profile to avoid thermal shock.
- Ensure the solder joints are clean and free of voids to ensure good electrical and thermal connections.
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