Specifications
SKU: 11244859
Super quick restore diode
Parameter | Symbol | Min | Typ | Max | Unit | Notes |
---|---|---|---|---|---|---|
Forward Voltage | VF | - | 1.0 | 1.3 | V @ IF = 20mA | |
Reverse Breakdown Voltage | VR | - | 50 | 100 | V @ IR = 1μA | |
Forward Current (Continuous) | IF | - | - | 100 | mA @ TA = 25°C | |
Forward Current (Pulsed) | IF(s) | - | - | 500 | mA @ tp = 10ms, fs = 10Hz | |
Reverse Current | IR | - | 100 | 500 | nA @ VR = 50V, TA = 25°C | |
Power Dissipation | PT | - | - | 200 | mW @ TA = 25°C | |
Operating Temperature | TOP | -40 | - | 125 | °C | |
Storage Temperature | TSTG | -55 | - | 150 | °C | |
Thermal Resistance | RθJ-A | - | 300 | - | K/W |
Instructions for Use:
- Mounting: Ensure proper heat dissipation by mounting the BYV26EGP on a heatsink if operating at high current or power levels.
- Reverse Voltage: Do not exceed the maximum reverse voltage to avoid damage.
- Forward Current: Stay within the continuous and pulsed forward current ratings to prevent overheating.
- Temperature Range: Operate within the specified temperature range to ensure reliable performance.
- Storage: Store in a dry environment within the storage temperature range to avoid degradation.
- Handling: Handle with care to avoid mechanical damage, especially to the leads.
- Soldering: Use appropriate soldering techniques and temperatures to avoid thermal shock. Soldering temperature should not exceed 260°C for more than 10 seconds.
- Electrostatic Discharge (ESD): Take necessary precautions to prevent ESD, which can damage the component.
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