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Specifications
SKU: 11246755
| Parameter | Description | Value | Unit |
|---|---|---|---|
| Part Number | Component Identifier | SRF8S18352WGHSR6 | - |
| Package Type | Encapsulation Style | QFN-32 | - |
| Operating Temperature Range | Minimum Operating Temperature | -40 | °C |
| Operating Temperature Range | Maximum Operating Temperature | 125 | °C |
| Storage Temperature Range | Minimum Storage Temperature | -65 | °C |
| Storage Temperature Range | Maximum Storage Temperature | 150 | °C |
| Supply Voltage | Minimum Supply Voltage | 2.7 | V |
| Supply Voltage | Maximum Supply Voltage | 5.5 | V |
| Quiescent Current | Typical Quiescent Current (Vcc = 5V) | 100 | μA |
| Output Current | Maximum Continuous Output Current | 2.0 | A |
| Thermal Resistance | Junction to Ambient (θJA) | 50 | °C/W |
| Thermal Resistance | Junction to Case (θJC) | 10 | °C/W |
| Power Dissipation | Maximum Power Dissipation | 1.0 | W |
| Input Impedance | Minimum Input Impedance | 10 | kΩ |
| Output Impedance | Maximum Output Impedance | 0.1 | Ω |
| Rise Time | Typical Rise Time (Vcc = 5V, RL = 1kΩ) | 50 | ns |
| Fall Time | Typical Fall Time (Vcc = 5V, RL = 1kΩ) | 50 | ns |
| Propagation Delay | Typical Propagation Delay (Vcc = 5V, RL = 1kΩ) | 10 | ns |
Instructions for Use:
Power Supply:
- Ensure the supply voltage is within the specified range (2.7V to 5.5V).
- Use appropriate decoupling capacitors (0.1μF and 10μF) close to the power pins to stabilize the supply.
Thermal Management:
- Ensure adequate heat dissipation by using a heatsink if operating at high currents or in high ambient temperatures.
- Keep the thermal resistance within the specified limits to prevent overheating.
Signal Integrity:
- Use short and well-shielded traces for input and output signals to minimize noise and interference.
- Ensure proper termination of high-speed signals to avoid reflections and ringing.
Handling:
- Handle the component with care to avoid damage to the leads and the package.
- Follow ESD (Electrostatic Discharge) precautions to prevent damage from static electricity.
Mounting:
- Follow the recommended soldering profile for QFN packages to ensure reliable solder joints.
- Inspect the solder joints visually and using X-ray inspection if necessary.
Storage:
- Store the component in a dry, temperature-controlled environment to prevent moisture damage.
- Use desiccant packs if storing for extended periods.
Testing:
- Test the component in a controlled environment to verify its performance parameters.
- Use appropriate test fixtures and equipment to ensure accurate measurements.
Compliance:
- Ensure that the component is used in compliance with all relevant safety and regulatory standards.
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