Instructions for Use:

1. Handling:

   • Handle the RXEF020 with care to avoid mechanical damage.
   • Use appropriate ESD (Electrostatic Discharge) precautions to prevent damage from static electricity.

2. Mounting:

   • Ensure that the PCB (Printed Circuit Board) is clean and free of contaminants.
   • Place the RXEF020 on the PCB using automated pick-and-place equipment or manual placement.
   • Apply solder paste to the pads before placing the component.
   • Follow the recommended reflow profile for the solder paste being used.

3. Reflow Soldering:

   • Preheat the PCB to 150°C for 60-90 seconds.
   • Ramp up to the peak temperature of 245°C at a rate of 2-3°C per second.
   • Maintain the peak temperature for 10-20 seconds.
   • Cool down to below 100°C at a rate of 3-5°C per second.

4. Inspection:

   • Visually inspect the solder joints for proper wetting and absence of voids or shorts.
   • Use an automated optical inspection (AOI) system if available.

5. Testing:

   • Perform electrical tests to verify the capacitance, voltage rating, and insulation resistance.
   • Ensure that the component meets the specified tolerance and temperature coefficient requirements.

6. Storage:

   • Store the RXEF020 in a dry, cool place away from direct sunlight.
   • Keep the components in their original packaging until ready for use to protect against moisture and static damage.

7. Disposal:

   • Dispose of any defective or unused components in accordance with local environmental regulations.