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MC14017BDR

Specifications

SKU: 11247178

BUY MC14017BDR https://www.utsource.net/itm/p/11247178.html

Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage VCC Operating 3.0 - 18 V
Input High Voltage VIH IIN = 100 μA 2.0 - VCC V
Input Low Voltage VIL IIN = -100 μA 0.8 - 2.0 V
Output High Voltage VOH IOL = -1 mA, VCC = 5 V 2.4 - VCC - 0.6 V
Output Low Voltage VOL IOL = 16 mA, VCC = 5 V 0 - 0.4 V
Propagation Delay Time tpd VCC = 5 V, TA = 25°C - 50 - ns
Power Dissipation PTOT TA = 25°C - - 100 mW
Operating Temperature Range TA - -40 - 85 °C
Storage Temperature Range TSTG - -65 - 150 °C

Instructions for Using MC14017BDR

  1. Supply Voltage:

    • Ensure the supply voltage (VCC) is within the range of 3.0 V to 18 V to avoid damage to the device.
  2. Input Levels:

    • For a valid high input (VIH), the voltage should be at least 2.0 V.
    • For a valid low input (VIL), the voltage should not exceed 2.0 V and should be at least 0.8 V below the supply voltage.
  3. Output Levels:

    • When the output is high (VOH), it will be at least 2.4 V when VCC is 5 V and the load current is -1 mA.
    • When the output is low (VOL), it will be no more than 0.4 V when VCC is 5 V and the load current is 16 mA.
  4. Propagation Delay:

    • The propagation delay time (tpd) is typically 50 ns at VCC = 5 V and TA = 25°C. This value can vary with different operating conditions.
  5. Power Dissipation:

    • The total power dissipation (PTOT) should not exceed 100 mW to prevent overheating and potential damage to the device.
  6. Temperature Ranges:

    • The operating temperature range (TA) is from -40°C to 85°C.
    • The storage temperature range (TSTG) is from -65°C to 150°C.
  7. Handling and Storage:

    • Handle the device with care to avoid static discharge, which can damage sensitive components.
    • Store the device in a dry, cool place within the specified storage temperature range.
  8. Mounting and Soldering:

    • Follow recommended soldering profiles to ensure proper mounting and to avoid thermal stress on the device.
    • Use appropriate flux and solder materials to ensure reliable connections.
  9. Testing and Verification:

    • After assembly, verify the functionality of the device by testing its input and output levels under typical operating conditions.
    • Monitor the temperature and power dissipation during operation to ensure they remain within safe limits.
(For reference only)

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