Specifications
SKU: 11247178
Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
---|---|---|---|---|---|---|
Supply Voltage | VCC | Operating | 3.0 | - | 18 | V |
Input High Voltage | VIH | IIN = 100 μA | 2.0 | - | VCC | V |
Input Low Voltage | VIL | IIN = -100 μA | 0.8 | - | 2.0 | V |
Output High Voltage | VOH | IOL = -1 mA, VCC = 5 V | 2.4 | - | VCC - 0.6 | V |
Output Low Voltage | VOL | IOL = 16 mA, VCC = 5 V | 0 | - | 0.4 | V |
Propagation Delay Time | tpd | VCC = 5 V, TA = 25°C | - | 50 | - | ns |
Power Dissipation | PTOT | TA = 25°C | - | - | 100 | mW |
Operating Temperature Range | TA | - | -40 | - | 85 | °C |
Storage Temperature Range | TSTG | - | -65 | - | 150 | °C |
Instructions for Using MC14017BDR
Supply Voltage:
- Ensure the supply voltage (VCC) is within the range of 3.0 V to 18 V to avoid damage to the device.
Input Levels:
- For a valid high input (VIH), the voltage should be at least 2.0 V.
- For a valid low input (VIL), the voltage should not exceed 2.0 V and should be at least 0.8 V below the supply voltage.
Output Levels:
- When the output is high (VOH), it will be at least 2.4 V when VCC is 5 V and the load current is -1 mA.
- When the output is low (VOL), it will be no more than 0.4 V when VCC is 5 V and the load current is 16 mA.
Propagation Delay:
- The propagation delay time (tpd) is typically 50 ns at VCC = 5 V and TA = 25°C. This value can vary with different operating conditions.
Power Dissipation:
- The total power dissipation (PTOT) should not exceed 100 mW to prevent overheating and potential damage to the device.
Temperature Ranges:
- The operating temperature range (TA) is from -40°C to 85°C.
- The storage temperature range (TSTG) is from -65°C to 150°C.
Handling and Storage:
- Handle the device with care to avoid static discharge, which can damage sensitive components.
- Store the device in a dry, cool place within the specified storage temperature range.
Mounting and Soldering:
- Follow recommended soldering profiles to ensure proper mounting and to avoid thermal stress on the device.
- Use appropriate flux and solder materials to ensure reliable connections.
Testing and Verification:
- After assembly, verify the functionality of the device by testing its input and output levels under typical operating conditions.
- Monitor the temperature and power dissipation during operation to ensure they remain within safe limits.
Inquiry - MC14017BDR