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MMBT5551LT1

Specifications

SKU: 11249303

BUY MMBT5551LT1 https://www.utsource.net/itm/p/11249303.html

Parameter Symbol Min Typical Max Unit
Collector-Emitter Voltage VCEO - 30 - V
Collector-Base Voltage VCBO - 45 - V
Emitter-Base Voltage VEBO - 6 - V
Collector Current IC - 150 - mA
Base Current IB - 5 - mA
Power Dissipation PT - 200 - mW
Operating Temperature Range TA -65 - 150 °C
Storage Temperature Range TSTG -65 - 150 °C
Transition Frequency fT - 300 - MHz
DC Current Gain (hFE) hFE 100 300 800 -

Instructions for Using MMBT5551LT1:

  1. Mounting:

    • Ensure that the transistor is mounted on a suitable PCB with appropriate thermal management if high power dissipation is expected.
    • Use a heat sink if the device will be operating at or near its maximum power dissipation.
  2. Polarity:

    • The MMBT5551LT1 is an NPN transistor. Ensure that the collector, base, and emitter are connected correctly to avoid damage.
    • Collector (C) should be connected to the higher potential, Base (B) to the control signal, and Emitter (E) to the lower potential.
  3. Biasing:

    • Proper biasing is crucial to ensure the transistor operates in the desired region (cut-off, active, or saturation).
    • For linear amplification, use a voltage divider network to bias the base.
  4. Protection:

    • Use a series resistor with the base to limit base current and prevent damage.
    • Consider using a reverse-biased diode across the collector-emitter terminals to protect against voltage spikes in inductive load applications.
  5. Storage:

    • Store the transistor in a dry, cool place to prevent moisture damage.
    • Handle with care to avoid static discharge, which can damage the device.
  6. Testing:

    • Before final assembly, test the transistor using a multimeter or a dedicated transistor tester to ensure it is functioning correctly.
    • Check for continuity between the base and emitter, and the collector and emitter, to verify the device is not shorted.
  7. Soldering:

    • Use a low-temperature soldering iron to avoid overheating the device.
    • Solder quickly to minimize thermal stress on the transistor.
  8. Applications:

    • The MMBT5551LT1 is suitable for a wide range of applications including small-signal amplification, switching circuits, and low-power RF applications.
(For reference only)

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