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74LVC1G32GW

Specifications

SKU: 11249313

BUY 74LVC1G32GW https://www.utsource.net/itm/p/11249313.html

Parameter Symbol Min Typ Max Unit Conditions
Supply Voltage VCC 1.65 - 5.5 V -
Input Low Voltage VIL -0.5 - 0.8 V VCC = 1.65V to 5.5V
Input High Voltage VIH 2.0 - VCC + 0.5 V VCC = 1.65V to 5.5V
Output Low Voltage VOL -0.5 - 0.1 V IOL = 4 mA, VCC = 1.65V to 5.5V
Output High Voltage VOH VCC - 0.1 - VCC + 0.5 V IOH = -0.4 mA, VCC = 1.65V to 5.5V
Input Leakage Current IIL -1 - 1 μA VCC = 0 to 5.5V
Output Leakage Current IOL -1 - 1 μA VCC = 0 to 5.5V
Propagation Delay Time tpd - 2.9 - ns VCC = 3.3V, TA = 25°C, VI = VCC/2, VO = VCC/2
Power Dissipation PD - - 100 mW -
Operating Temperature TOP -40 - 85 °C -
Storage Temperature TSTG -65 - 150 °C -

Instructions for Use:

  1. Supply Voltage (VCC):

    • Ensure the supply voltage is within the range of 1.65V to 5.5V.
    • Avoid connecting the supply voltage outside this range to prevent damage to the device.
  2. Input Voltage Levels:

    • For a logic low input, the voltage should be between -0.5V and 0.8V.
    • For a logic high input, the voltage should be between 2.0V and VCC + 0.5V.
  3. Output Voltage Levels:

    • The output will be considered low if it is below 0.1V when sourcing 4 mA.
    • The output will be considered high if it is above VCC - 0.1V when sinking -0.4 mA.
  4. Current Ratings:

    • Ensure that the input leakage current does not exceed ±1 μA.
    • Ensure that the output leakage current does not exceed ±1 μA.
  5. Propagation Delay:

    • The propagation delay time is typically 2.9 ns at VCC = 3.3V and TA = 25°C.
  6. Power Dissipation:

    • The maximum power dissipation is 100 mW. Ensure proper heat dissipation if operating near this limit.
  7. Temperature Ranges:

    • The operating temperature range is from -40°C to 85°C.
    • The storage temperature range is from -65°C to 150°C.
  8. Handling Precautions:

    • Handle the device with care to avoid static damage.
    • Follow ESD (Electrostatic Discharge) guidelines during handling and installation.
  9. Mounting and Soldering:

    • Use appropriate soldering techniques to ensure reliable connections.
    • Avoid overheating during soldering to prevent damage to the device.
  10. Testing:

    • Perform initial testing under controlled conditions to verify functionality.
    • Ensure all connections are secure and correct before applying power.
(For reference only)

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