Instructions for Use:

1. Mounting:

   • Ensure proper heat sinking to maintain junction temperature within the specified range.
   • Use a thermal compound between the device and the heat sink for optimal thermal performance.

2. Gate Drive:

   • Apply a gate current (IGT) of at least 35 mA to ensure reliable turn-on.
   • For turn-off, ensure the gate is pulled to a low impedance state to avoid false triggering.

3. Current Handling:

   • Do not exceed the peak on-state current (ITSM) of 100 A for more than 10 ms and 10 Hz.
   • Continuous operation should be within the rated RMS on-state current (IT(RMS)) of 25 A.

4. Voltage Handling:

   • Ensure the off-state voltage does not exceed the rated off-state voltage (VDRM) of 600 V.
   • For non-repetitive conditions, the peak off-state voltage (VRRM) can reach up to 800 V.

5. Thermal Management:

   • Monitor the junction temperature (TJ) to ensure it remains within the -55°C to 125°C range.
   • Store the device in an environment where the temperature ranges from -55°C to 150°C.

6. Handling Precautions:

   • Handle the device with care to avoid mechanical damage.
   • Use appropriate ESD protection to prevent damage from static electricity.

7. Testing:

   • Test the device under controlled conditions to verify its performance and reliability.
   • Refer to the datasheet for detailed testing procedures and recommended test circuits.

8. Applications:

   • Suitable for applications requiring high current and voltage handling, such as motor control, lighting, and power supply circuits.