Specifications
SKU: 11253418
Parameter | Symbol | Value | Unit |
---|---|---|---|
Drain-Source Voltage | VDS | ±300 | V |
Gate-Source Voltage | VGS | ±20 | V |
Continuous Drain Current | ID | 15 | A |
Pulse Drain Current | ID(PULSE) | 60 | A |
Transconductance | gfs | 12 | S |
Input Capacitance | Ciss | 1800 | pF |
Output Capacitance | Coss | 250 | pF |
Reverse Transfer Capacitance | Crss | 150 | pF |
Junction Temperature | TJ | -55 to +175 | °C |
Storage Temperature | TSTG | -55 to +150 | °C |
Instructions for Use:
Handling Precautions:
- Handle the 2SK2401 with care to avoid damage to the leads or the body.
- Use anti-static precautions to prevent damage from electrostatic discharge (ESD).
Mounting:
- Ensure that the mounting surface is clean and flat.
- Apply thermal compound between the device and the heat sink to improve thermal conductivity.
- Torque the mounting screws to the recommended specifications to avoid over-tightening.
Biasing:
- Apply the gate-source voltage (VGS) carefully to avoid exceeding the maximum ratings.
- Ensure that the drain-source voltage (VDS) does not exceed the maximum rating during operation.
Thermal Management:
- Monitor the junction temperature (TJ) to ensure it stays within the operational range.
- Use a heatsink if necessary to dissipate heat effectively.
Testing:
- Test the device under controlled conditions to verify its performance.
- Use appropriate test equipment and follow safety guidelines to avoid damage to the device or injury.
Storage:
- Store the 2SK2401 in a dry, cool place to prevent moisture damage.
- Keep the device in its original packaging until ready for use to protect it from physical damage and ESD.
Inquiry - 2SK2401