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2SK2401

Specifications

SKU: 11253418

BUY 2SK2401 https://www.utsource.net/itm/p/11253418.html

Parameter Symbol Value Unit
Drain-Source Voltage VDS ±300 V
Gate-Source Voltage VGS ±20 V
Continuous Drain Current ID 15 A
Pulse Drain Current ID(PULSE) 60 A
Transconductance gfs 12 S
Input Capacitance Ciss 1800 pF
Output Capacitance Coss 250 pF
Reverse Transfer Capacitance Crss 150 pF
Junction Temperature TJ -55 to +175 °C
Storage Temperature TSTG -55 to +150 °C

Instructions for Use:

  1. Handling Precautions:

    • Handle the 2SK2401 with care to avoid damage to the leads or the body.
    • Use anti-static precautions to prevent damage from electrostatic discharge (ESD).
  2. Mounting:

    • Ensure that the mounting surface is clean and flat.
    • Apply thermal compound between the device and the heat sink to improve thermal conductivity.
    • Torque the mounting screws to the recommended specifications to avoid over-tightening.
  3. Biasing:

    • Apply the gate-source voltage (VGS) carefully to avoid exceeding the maximum ratings.
    • Ensure that the drain-source voltage (VDS) does not exceed the maximum rating during operation.
  4. Thermal Management:

    • Monitor the junction temperature (TJ) to ensure it stays within the operational range.
    • Use a heatsink if necessary to dissipate heat effectively.
  5. Testing:

    • Test the device under controlled conditions to verify its performance.
    • Use appropriate test equipment and follow safety guidelines to avoid damage to the device or injury.
  6. Storage:

    • Store the 2SK2401 in a dry, cool place to prevent moisture damage.
    • Keep the device in its original packaging until ready for use to protect it from physical damage and ESD.
(For reference only)

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