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G50N60RUF

Specifications

SKU: 11255250

BUY G50N60RUF https://www.utsource.net/itm/p/11255250.html

Parameter Symbol Min Typ Max Unit Description
Breakdown Voltage V(BR)DSS - 600 - V Drain-to-source breakdown voltage
Continuous Drain Current (Tc = 25°C) ID - 50 - A Continuous drain current at Tc = 25°C
Continuous Drain Current (Tc = 100°C) ID - 35 - A Continuous drain current at Tc = 100°C
Gate Threshold Voltage VGS(th) 2.0 4.0 6.0 V Gate threshold voltage
On-State Resistance (VGS = 10V, ID = 50A) RDS(on) - 0.085 - Ω On-state resistance
Total Power Dissipation (Tc = 25°C) PD - 200 - W Total power dissipation at Tc = 25°C
Junction Temperature TJ -55 - 175 °C Operating junction temperature range
Storage Temperature Range Tstg -55 - 150 °C Storage temperature range

Instructions for Use:

  1. Handling Precautions:

    • Handle the device with care to avoid damage.
    • Use proper ESD (Electrostatic Discharge) protection when handling the device.
  2. Mounting:

    • Ensure proper thermal management by using appropriate heatsinks or cooling solutions.
    • Follow recommended PCB layout guidelines to minimize parasitic inductance and ensure reliable operation.
  3. Biasing:

    • Apply gate voltage (VGS) within the specified range to avoid damage.
    • Ensure the gate-source voltage does not exceed the maximum ratings.
  4. Operating Conditions:

    • Operate the device within the specified temperature ranges to prevent thermal runaway.
    • Monitor the junction temperature to ensure it stays within safe limits.
  5. Testing:

    • Perform initial testing under controlled conditions to verify performance.
    • Use appropriate test equipment and methods to avoid overstressing the device.
  6. Storage:

    • Store the device in a dry, cool place away from direct sunlight.
    • Keep the device in its original packaging until ready for use to protect against moisture and static.
  7. Soldering:

    • Use a soldering iron with a temperature-controlled tip.
    • Avoid excessive heat and prolonged soldering times to prevent damage to the device.
  8. Documentation:

    • Refer to the datasheet and application notes for detailed information and specific recommendations.
    • Stay updated with the latest product information and technical support from the manufacturer.
(For reference only)

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