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IRF6215

Specifications

SKU: 11255537

BUY IRF6215 https://www.utsource.net/itm/p/11255537.html

Parameter Symbol Test Conditions Min Typical Max Unit
Drain-Source Voltage VDS - - 55 - V
Gate-Source Voltage VGS - - ±20 - V
Continuous Drain Current ID TC = 25°C - 45 - A
Continuous Drain Current ID TC = 75°C - 33 - A
Pulse Drain Current IDpeak tp = 10 ms, IG = 8 A - 110 - A
Total Power Dissipation PTOT TC = 25°C - 140 - W
Junction Temperature TJ - - - 150 °C
Storage Temperature Range TSTG - -65 - 150 °C
Thermal Resistance, Junction to Case RθJC - - 0.5 - °C/W
Gate Charge QG VGS = 10 V, ID = 11 A - 95 - nC
Input Capacitance Ciss VDS = 25 V, f = 1 MHz - 1440 - pF
Output Capacitance Coss VDS = 25 V, f = 1 MHz - 250 - pF
Reverse Transfer Capacitance Crss VDS = 25 V, ID = 11 A, f = 1 MHz - 120 - pF
Threshold Gate Voltage VGS(th) ID = 250 μA 2.0 4.0 6.0 V
On-State Resistance RDS(on) VGS = 10 V, ID = 11 A - 0.028 - Ω
Turn-On Delay Time td(on) VGS = 10 V, IG = 8 A, ID = 11 A - 32 - ns
Rise Time tr VGS = 10 V, IG = 8 A, ID = 11 A - 34 - ns
Turn-Off Delay Time td(off) VGS = 10 V, IG = 8 A, ID = 11 A - 17 - ns
Fall Time tf VGS = 10 V, IG = 8 A, ID = 11 A - 30 - ns

Instructions for Use:

  1. Handling Precautions:

    • The IRF6215 is sensitive to electrostatic discharge (ESD). Handle with care and use proper ESD protection.
    • Avoid exceeding the maximum ratings to prevent damage.
  2. Mounting:

    • Ensure good thermal management by using a heatsink if necessary, especially when operating at high power levels.
    • Follow the recommended PCB layout guidelines to minimize parasitic inductances and improve performance.
  3. Biasing:

    • Apply the gate voltage (VGS) carefully to avoid exceeding the maximum gate-source voltage.
    • Use a gate resistor to control the switching speed and reduce ringing.
  4. Operation:

    • Ensure that the drain-source voltage (VDS) does not exceed the maximum rating.
    • Operate within the specified temperature range to maintain reliability and longevity.
  5. Testing:

    • When testing the device, use appropriate test conditions as specified in the parameter table to obtain accurate results.
    • Verify the on-state resistance (RDS(on)) and other key parameters to ensure the device is functioning correctly.
  6. Storage:

    • Store the device in a dry, cool place away from direct sunlight and sources of heat.
    • Keep the device in its original packaging until ready for use to protect against ESD.

By following these instructions, you can ensure optimal performance and reliability of the IRF6215 MOSFET.

(For reference only)

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