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MT7936

Specifications

SKU: 11256844

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Parameter Description Min Typ Max Unit
Operating Voltage (Vcc) Supply voltage range 2.7 - 5.5 V
Operating Current (Icc) Supply current - 100 - mA
Operating Temperature (Tamb) Ambient temperature range -40 - 85 °C
Storage Temperature (Tstg) Storage temperature range -65 - 150 °C
Input Frequency (fIN) Input signal frequency 10 - 100 kHz
Output Voltage (Vout) Output voltage range 0 - Vcc V
Output Current (Iout) Maximum output current - 20 - mA
Rise Time (tr) Output rise time - 10 - ns
Fall Time (tf) Output fall time - 10 - ns
Propagation Delay (tpd) Propagation delay time - 50 - ns
Quiescent Current (IQ) Quiescent current - 1 - μA
Power Consumption (Pd) Power dissipation - 500 - mW

Instructions for Use

  1. Power Supply:

    • Ensure the supply voltage (Vcc) is within the specified range of 2.7V to 5.5V.
    • Connect the power supply to the Vcc pin and ground (GND) pin.
  2. Input Signal:

    • Apply the input signal to the IN pin with a frequency between 10kHz and 100kHz.
    • Ensure the input signal amplitude is compatible with the supply voltage.
  3. Output Configuration:

    • The output voltage (Vout) will be proportional to the input signal and can range from 0V to Vcc.
    • Connect the load to the OUT pin, ensuring the current does not exceed 20mA.
  4. Temperature Considerations:

    • Operate the device within the ambient temperature range of -40°C to 85°C.
    • Store the device in an environment where the temperature ranges from -65°C to 150°C.
  5. Timing Parameters:

    • The propagation delay (tpd) is typically 50ns, and the rise and fall times (tr, tf) are each approximately 10ns.
  6. Quiescent Current:

    • The quiescent current (IQ) is typically 1μA, which helps in minimizing power consumption when the device is idle.
  7. Power Dissipation:

    • The maximum power dissipation (Pd) is 500mW. Ensure proper heat dissipation if operating near this limit.
  8. Handling Precautions:

    • Handle the device with care to avoid static damage.
    • Follow standard ESD (Electrostatic Discharge) precautions during handling and installation.
  9. Mounting:

    • Solder the device to the PCB using recommended soldering techniques and temperatures.
    • Ensure all connections are secure and free from shorts or open circuits.
  10. Testing:

    • After assembly, test the device under typical operating conditions to ensure it meets the specified performance parameters.
(For reference only)

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