Share:


SS310

Specifications

SKU: 11257325

BUY SS310 https://www.utsource.net/itm/p/11257325.html

Parameter Description Value
Part Number Part Number SS310
Type Type of Component Schottky Diode
Package Package Type SOD-123
Forward Voltage Maximum Forward Voltage (VF) at 1A 0.45V
Reverse Voltage Maximum Reverse Voltage (VRRM) 100V
Average Rectified Current Average Rectified Current (IF(AV)) 1A
Peak Reverse Current Peak Reverse Current (IRM) 150mA
Junction Temperature Maximum Junction Temperature (TJ) 150°C
Storage Temperature Storage Temperature Range (TSTG) -65°C to 150°C
Power Dissipation Maximum Power Dissipation (PD) 625mW
Thermal Resistance Junction to Ambient Thermal Resistance (RθJA) 200°C/W
Capacitance Capacitance (CJ) at 0V, 1MHz 30pF
Leakage Current Reverse Leakage Current (IR) at 100V, 25°C 100nA

Instructions for Use

  1. Mounting:

    • Ensure the diode is mounted on a clean, flat surface.
    • Use appropriate soldering techniques to avoid thermal shock and ensure good electrical and thermal connections.
  2. Handling:

    • Handle the diode with care to avoid mechanical damage.
    • Use static-safe equipment and practices to prevent electrostatic discharge (ESD) damage.
  3. Operating Conditions:

    • Do not exceed the maximum ratings specified in the table.
    • Ensure the operating temperature remains within the specified range to avoid thermal stress.
  4. Storage:

    • Store the diode in a dry, cool place within the specified storage temperature range.
    • Avoid exposure to high humidity and corrosive environments.
  5. Testing:

    • Use a multimeter or a diode tester to verify the functionality of the diode.
    • Check for forward and reverse characteristics to ensure proper operation.
  6. Soldering:

    • Preheat the diode to reduce thermal stress during soldering.
    • Use a soldering iron with a temperature no higher than 300°C.
    • Complete the soldering process within 10 seconds to minimize heat exposure.
  7. PCB Layout:

    • Place the diode close to the heat sink if necessary to improve thermal performance.
    • Ensure adequate spacing between components to allow for proper cooling and to avoid interference.
  8. Troubleshooting:

    • If the diode fails, check for overvoltage, overcurrent, or overheating conditions.
    • Replace the diode if it shows signs of physical damage or if it fails to meet the specified electrical characteristics.
(For reference only)

 Inquiry - SS310