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74LVC1G32SE-7

Specifications

SKU: 11263817

BUY 74LVC1G32SE-7 https://www.utsource.net/itm/p/11263817.html

Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage VCC Operating 1.65 - 5.5 V
Input Low Voltage VIL VCC = 3.3V 0 - 0.8 V
Input High Voltage VIH VCC = 3.3V 2.0 - VCC V
Output Low Voltage VOL IOL = 4 mA, VCC = 3.3V 0 - 0.4 V
Output High Voltage VOH IOH = -4 mA, VCC = 3.3V 2.4 - VCC V
Input Leakage Current IIL VCC = 3.3V -1 - 1 μA
Output Leakage Current IOL VCC = 3.3V, VO = 0V -1 - 1 μA
Propagation Delay Time tpd VCC = 3.3V, TA = 25°C - 3.5 - ns
Power Dissipation Ptot Continuous - - 100 mW

Instructions for Use:

  1. Supply Voltage (VCC):

    • Ensure the supply voltage is within the range of 1.65V to 5.5V.
    • Avoid exceeding the maximum voltage to prevent damage to the device.
  2. Input Voltages (VIL, VIH):

    • For reliable operation, input voltages should be within the specified ranges.
    • VIL should not exceed 0.8V when VCC is 3.3V.
    • VIH should be at least 2.0V when VCC is 3.3V.
  3. Output Voltages (VOL, VOH):

    • When driving a load, ensure the output voltages meet the specified levels.
    • VOL should not exceed 0.4V under the given conditions.
    • VOH should be at least 2.4V under the given conditions.
  4. Leakage Currents (IIL, IOL):

    • Monitor the leakage currents to ensure they do not exceed 1μA.
    • Excessive leakage can affect circuit performance.
  5. Propagation Delay (tpd):

    • The propagation delay time is crucial for timing considerations in digital circuits.
    • Ensure that the delay time does not exceed 3.5ns for optimal performance.
  6. Power Dissipation (Ptot):

    • Keep the total power dissipation below 100mW to avoid overheating and potential damage.
  7. Environmental Conditions:

    • Operate the device within the recommended temperature range to ensure reliability and longevity.
    • Store and handle the device in a dry environment to prevent moisture damage.
  8. Handling Precautions:

    • Use proper ESD (Electrostatic Discharge) protection when handling the device.
    • Avoid applying excessive mechanical stress to the pins or package.
  9. Mounting:

    • Follow the recommended soldering and mounting procedures to ensure a secure and reliable connection.
    • Use appropriate thermal management techniques if operating in high-temperature environments.
(For reference only)

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