Share:
Specifications
SKU: 11267328
| Parameter | Symbol | Min | Typ | Max | Unit | Description |
|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | - | 600 | - | V | Maximum voltage between drain and source with gate open |
| Gate-Source Voltage | VGS | -15 | 0 | 15 | V | Maximum voltage between gate and source |
| Continuous Drain Current | ID | - | 11 | - | A | Maximum continuous drain current at TC = 25°C |
| Pulse Drain Current | IDpeak | - | 33 | - | A | Maximum pulse drain current (tp ≤ 10 ms, IG = 11 A) |
| Total Power Dissipation | PTOT | - | 175 | - | W | Maximum total power dissipation at TC = 25°C |
| Junction Temperature | TJ | - | - | 150 | °C | Maximum junction temperature |
| Storage Temperature Range | TSTG | -55 | - | 150 | °C | Operating temperature range for storage |
| Thermal Resistance, Junction to Case | RθJC | - | 0.55 | - | °C/W | Thermal resistance from junction to case |
Instructions:
Handling Precautions:
- Handle the FQU2N60B with care to avoid static damage.
- Use proper ESD (Electrostatic Discharge) protection equipment when handling.
Mounting:
- Ensure that the mounting surface is clean and flat to ensure good thermal contact.
- Use a suitable heat sink to dissipate heat effectively, especially if operating near maximum power dissipation.
Biasing:
- Apply the gate-source voltage (VGS) within the specified limits to avoid damaging the device.
- Ensure that the gate drive circuitry is capable of providing sufficient current to charge and discharge the gate capacitance quickly.
Operating Conditions:
- Do not exceed the maximum drain-source voltage (VDS) or the maximum junction temperature (TJ).
- Monitor the drain current (ID) to ensure it does not exceed the continuous or pulse ratings.
Storage:
- Store the FQU2N60B in a dry, cool place within the specified storage temperature range (TSTG).
Testing:
- When testing the device, use appropriate test equipment and follow safety guidelines to prevent damage to the device or injury to personnel.
Soldering:
- Use a soldering iron or soldering station with a temperature-controlled tip.
- Soldering time should be kept to a minimum to avoid overheating the device.
- Allow the device to cool down before handling after soldering.
Inquiry - FQU2N60B
